- Termination :
- Housing Material :
-
- Diallyl Phthalate (DAP) (1)
- Fluoropolymer (FP) (1)
- Phenolic (1)
- Polyamide (PA), Nylon (1)
- Polyamide (PA), Nylon, Glass Filled (1)
- Polyamide (PA46), Nylon 4/6, Glass Filled (11)
- Polybutylene Terephthalate (PBT), Glass Filled (1)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (1)
- Polyester (1)
- Polyester, Glass Filled (1)
- Polyphenylene Sulfide (PPS) (7)
- Polyphenylene Sulfide (PPS), Glass Filled (1)
- Polysulfone (PSU), Glass Filled (2)
- Thermoplastic (5)
- Thermoplastic, Polyester (9)
- Thermoplastic, Polyester, Glass Filled (2)
- Pitch - Mating :
- Contact Finish - Mating :
- Contact Finish Thickness - Mating :
- Number of Positions or Pins (Grid) :
-
- 10 (1 x 10) (4)
- 11 (1 x 11) (1)
- 114 (13 x 13) (1)
- 12 (1 x 12) (1)
- 14 (1 x 14) (1)
- 14 (2 x 7) (1)
- 16 (1 x 16) (2)
- 16 (2 x 8) (1)
- 169 (17 x 17) (1)
- 20 (1 x 20) (4)
- 20 (2 x 10) (1)
- 20 (Round) (1)
- 24 (2 x 12) (3)
- 28 (2 x 14) (4)
- 3 (Oval) (2)
- 3 (Rectangular) (4)
- 32 (2 x 16) (1)
- 321 (19 x 19) (2)
- 39 (1 x 19, 1 x 20) (2)
- 4 (2 x 2) (1)
- 48 (2 x 24) (1)
- 5 (1 x 5) (1)
- 5 (Rectangular) (2)
- 7 (1 x 7) (1)
- 8 (2 x 4) (1)
- 8 (Oval) (1)
- 8 (Round) (2)
- Contact Material - Mating :
- Contact Finish Thickness - Post :
- Contact Material - Post :
- Applied Filters :
48 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
1,267
In-stock
|
3M | CONN ZIG-ZAG 39POS GOLD | - | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | Zig-Zag | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 39 (1 x 19, 1 x 20) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
|
VIEW |
2,639
In-stock
|
3M | CONN ZIG-ZAG 39POS GOLD | - | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | Zig-Zag | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 39 (1 x 19, 1 x 20) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
|
VIEW |
3,492
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Spacer | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 28 (2 x 14) | Brass | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,738
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Spacer | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 48 (2 x 24) | Brass | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,359
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Spacer | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 32 (2 x 16) | Brass | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,282
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Spacer | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 24 (2 x 12) | Brass | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
720
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Spacer | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 24 (2 x 12) | Brass | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,175
In-stock
|
Sullins Connector Solutions | CONN TRANSIST TO-254 3POS GOLD | - | Active | Bulk | -50°C ~ 175°C | Through Hole | Solder | Flange | Transistor, TO-254 | Polyphenylene Sulfide (PPS) | 0.150" (3.81mm) | Gold | 30.0µin (0.76µm) | Gold | 3 (Rectangular) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
|
VIEW |
1,850
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Spacer | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 28 (2 x 14) | Brass | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,465
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET PGA 321POS GOLD | - | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Open Frame | PGA | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 321 (19 x 19) | Copper Alloy | - | Copper Alloy | |||
|
|
VIEW |
1,604
In-stock
|
TE Connectivity Potter & Brumfield Relays | CONN SOCKET TRANSIST TO-5 20POS | - | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-5 | Fluoropolymer (FP) | - | Gold | - | Gold | 20 (Round) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
1,376
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Spacer | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 16 (2 x 8) | Brass | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,398
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Spacer | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 14 (2 x 7) | Brass | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,471
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Spacer | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 8 (2 x 4) | Brass | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,308
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET PGA 321POS GOLD | - | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Open Frame | PGA | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 321 (19 x 19) | Copper Alloy | - | Copper Alloy | |||
|
|
VIEW |
2,775
In-stock
|
Aries Electronics | CONN SOCKET PGA ZIF GOLD | - | Active | Bulk | -65°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
1,847
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Spacer | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 20 (2 x 10) | Brass | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,335
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Spacer | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 28 (2 x 14) | Brass | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,228
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS | - | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | - | - | - | 28 (2 x 14) | Beryllium Copper | - | Copper | |||
|
|
VIEW |
2,076
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-5 8POS | - | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-5 | Polyamide (PA), Nylon, Glass Filled | - | Gold | - | Gold | 8 (Round) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
1,176
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 20POS GOLD | - | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 20 (1 x 20) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
|
VIEW |
2,030
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET PGA 114POS GOLD | - | Active | Bulk | - | Through Hole | Press-Fit | Open Frame | PGA | Thermoplastic, Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 114 (13 x 13) | Beryllium Copper | 118.1µin (3.00µm) | Phosphor Bronze | |||
|
|
VIEW |
835
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-3 | Phenolic | - | Tin-Lead | 200.0µin (5.08µm) | Tin-Lead | 3 (Oval) | Beryllium Copper | - | Beryllium Copper | |||
|
|
VIEW |
1,845
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 16POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Thermoplastic | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 16 (1 x 16) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,269
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 16POS GOLD | - | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | Flash | Tin | 16 (1 x 16) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
3,062
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-3 | Diallyl Phthalate (DAP) | - | Gold | 50.0µin (1.27µm) | Gold | 3 (Oval) | Beryllium Copper | - | Beryllium Copper | |||
|
|
VIEW |
1,365
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET PGA 169POS GOLD | - | Active | Bulk | - | Through Hole | Press-Fit | Open Frame | PGA | Thermoplastic, Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin-Lead | 169 (17 x 17) | Beryllium Copper | 196.9µin (5.00µm) | Phosphor Bronze | |||
|
|
VIEW |
1,852
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-5 8POS | - | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-5 | Polyamide (PA), Nylon | - | Gold | - | Gold | 8 (Round) | Copper Alloy | - | Copper Alloy | |||
|
|
VIEW |
3,537
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 10POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Thermoplastic | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 10 (1 x 10) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
1,881
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Gold | - | Tin | 24 (2 x 12) | Beryllium Copper | - | Brass | |||
