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- Series :
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4 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | |
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GLOBAL STOCKS | |||||||||||||||||||||
VIEW |
2,515
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 40POS GLD | Lo-PRO®file, 526 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP) | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 40 (2 x 20) | Beryllium Copper | ||||
VIEW |
3,518
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS GLD | Lo-PRO®file, 526 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP) | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 24 (2 x 12) | Beryllium Copper | ||||
VIEW |
2,597
In-stock
|
3M | CONN IC DIP SOCKET ZIF 90POS GLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | 90 (2 x 45) | Beryllium Copper | ||||
VIEW |
2,476
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | Lo-PRO®file, 526 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP) | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 28 (2 x 14) | Beryllium Copper |