Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post
GLOBAL STOCKS
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3,079
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3M CONN ZIG-ZAG ZIF 51POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 51 (1 x 25, 1 x 26) Beryllium Copper 0.050" (1.27mm)
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1,594
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3M CONN ZIG-ZAG ZIF 51POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 51 (1 x 25, 1 x 26) Beryllium Copper 0.050" (1.27mm)
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RFQ
1,340
In-stock
3M CONN ZIG-ZAG ZIF 35POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 35 (1 x 17, 1 x 18) Beryllium Copper 0.050" (1.27mm)
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1,425
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3M CONN ZIG-ZAG ZIF 35POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 35 (1 x 17, 1 x 18) Beryllium Copper 0.050" (1.27mm)
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RFQ
3,872
In-stock
3M CONN ZIG-ZAG ZIF 35POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 35 (1 x 17, 1 x 18) Beryllium Copper 0.050" (1.27mm)
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RFQ
1,541
In-stock
3M CONN ZIG-ZAG ZIF 35POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 35 (1 x 17, 1 x 18) Beryllium Copper 0.050" (1.27mm)
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2,113
In-stock
3M CONN ZIG-ZAG ZIF 34POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 34 (2 x 17) Beryllium Copper 0.050" (1.27mm)
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2,128
In-stock
3M CONN ZIG-ZAG ZIF 34POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 34 (1 x 34) Beryllium Copper 0.050" (1.27mm)
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RFQ
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RFQ
3,597
In-stock
3M CONN ZIG-ZAG ZIF 34POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 34 (2 x 17) Beryllium Copper 0.050" (1.27mm)
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RFQ
VIEW
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941
In-stock
3M CONN ZIG-ZAG ZIF 34POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 34 (2 x 17) Beryllium Copper 0.050" (1.27mm)
218-7223-55-1902
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3,287
In-stock
3M CONN SOCKET SOIC 18POS GOLD Textool™ Active Bulk -55°C ~ 150°C Through Hole Solder Closed Frame SOIC Polyethersulfone (PES), Glass Filled - Gold - 18 (2 x 9) Beryllium Copper -
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2,422
In-stock
3M CONN SOCKET PGA ZIF 32POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm)
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RFQ
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RFQ
1,947
In-stock
3M CONN SOCKET PGA ZIF 32POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm)
260-5204-01
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3,040
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3M CONN SOCKET QFN 60POS GOLD Textool™ Active Bulk - Through Hole Solder Open Frame QFN Polyethersulfone (PES) 0.020" (0.50mm) Gold - 60 (4 x 15) Beryllium Copper 0.020" (0.50mm)
280-5205-01
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3,533
In-stock
3M CONN SOCKET QFN 80POS GOLD Textool™ Active Tray - Through Hole Solder Open Frame QFN Polyethersulfone (PES) 0.020" (0.50mm) Gold - 80 (4 x 20) Beryllium Copper 0.020" (0.50mm)
260-4204-01
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1,506
In-stock
3M CONN SOCKET QFN 60POS GOLD Textool™ Active Bulk - Through Hole Solder Open Frame QFN Polyethersulfone (PES) 0.016" (0.40mm) Gold - 60 (4 x 15) Beryllium Copper 0.016" (0.40mm)
248-4205-01
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2,942
In-stock
3M CONN SOCKET QFN 48POS GOLD Textool™ Active Bulk - Through Hole Solder Closed Frame QFN Polyethersulfone (PES) 0.016" (0.40mm) Gold - 48 (4 x 12) Beryllium Copper -
200-6313-9UN-1900
RFQ
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RFQ
2,422
In-stock
3M CONN SOCKET PGA ZIF 169POS GOLD Textool™ Active Bulk -55°C ~ 150°C Through Hole Solder - PGA, ZIF (ZIP) Polyethersulfone (PES) 0.100" (2.54mm) Gold 30.0µin (0.76µm) 169 (13 x 13) Beryllium Copper 0.100" (2.54mm)
224-5809-00-0602
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1,283
In-stock
3M CONN SOCKET SIP ZIF 24POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder - SIP, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold - 24 (1 x 24) Beryllium Copper 0.100" (2.54mm)
200-6321-9UN-1900
RFQ
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RFQ
1,027
In-stock
3M CONN SOCKET PGA ZIF 441POS GOLD Textool™ Active Bulk -55°C ~ 150°C Through Hole Solder - PGA, ZIF (ZIP) Polyethersulfone (PES) 0.100" (2.54mm) Gold 30.0µin (0.76µm) 441 (21 x 21) Beryllium Copper 0.100" (2.54mm)
200-6319-9UN-1900
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3,760
In-stock
3M CONN SOCKET PGA ZIF 361POS GOLD Textool™ Active Bulk -55°C ~ 150°C Through Hole Solder - PGA, ZIF (ZIP) Polyethersulfone (PES) 0.100" (2.54mm) Gold 30.0µin (0.76µm) 361 (19 x 19) Beryllium Copper 0.100" (2.54mm)
224-5205-01
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RFQ
2,324
In-stock
3M CONN SOCKET QFN 24POS GOLD Textool™ Active Bulk - Through Hole Solder - QFN Polyethersulfone (PES) 0.020" (0.50mm) Gold - 24 (4 x 6) Beryllium Copper -
232-2601-00-0602
RFQ
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RFQ
792
In-stock
3M CONN SOCKET SIP ZIF 32POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder - SIP, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold - 32 (1 x 32) Beryllium Copper 0.100" (2.54mm)
200-6310-9UN-1900
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RFQ
1,447
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3M CONN SOCKET PGA ZIF 100POS GOLD Textool™ Active Bulk -55°C ~ 150°C Through Hole Solder - PGA, ZIF (ZIP) Polyethersulfone (PES) 0.100" (2.54mm) Gold 30.0µin (0.76µm) 100 (10 x 10) Beryllium Copper 0.100" (2.54mm)
216-7383-55-1902
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RFQ
1,809
In-stock
3M CONN SOCKET SOIC 16POS GOLD Textool™ Active Bulk -55°C ~ 150°C Through Hole Solder Closed Frame SOIC Polyethersulfone (PES), Glass Filled - Gold - 16 (2 x 8) Beryllium Copper -
232-5205-01
RFQ
VIEW
RFQ
1,037
In-stock
3M CONN SOCKET QFN 32POS GOLD Textool™ Active Bulk - Through Hole Solder Closed Frame QFN Polyethersulfone (PES) - Gold - 32 (4 x 8) Beryllium Copper -
228-5204-01
RFQ
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RFQ
1,842
In-stock
3M CONN SOCKET QFN 28POS GOLD Textool™ Active Bulk - Through Hole Solder - QFN Polyethersulfone (PES) 0.020" (0.50mm) Gold - 28 (4 x 7) Beryllium Copper -
216-5205-01
RFQ
VIEW
RFQ
2,525
In-stock
3M CONN SOCKET QFN 16POS GOLD Textool™ Active Bulk - Through Hole Solder - QFN Polyethersulfone (PES) 0.020" (0.50mm) Gold - 16 (4 x 4) Beryllium Copper -
228-7396-55-1902
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RFQ
1,560
In-stock
3M CONN SOCKET SOIC 28POS GOLD Textool™ Active Bulk -55°C ~ 150°C Through Hole Solder Closed Frame SOIC Polyethersulfone (PES), Glass Filled - Gold - 28 (2 x 14) Beryllium Copper -
216-7224-55-1902
RFQ
VIEW
RFQ
2,685
In-stock
3M CONN SOCKET SOIC 16POS GOLD Textool™ Active Bulk -55°C ~ 150°C Through Hole Solder Closed Frame SOIC Polyethersulfone (PES), Glass Filled - Gold - 16 (2 x 8) Beryllium Copper -