Sockets for ICs, Transistors Products For Sale - PDF - Connectors, Interconnects -

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Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Packaging	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish Thickness - Post	Contact Material - Post
GLOBAL STOCKS
	18-0513-10H	RFQ VIEW	PDF RFQ	3,123 In-stock	Aries Electronics	CONN SOCKET SIP 18POS GOLD		0513	Active	Bulk	Through Hole	Solder	-	SIP	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	18 (1 x 18)	Beryllium Copper	200.0µin (5.08µm)	Brass
	18-0513-11	RFQ VIEW	PDF RFQ	3,535 In-stock	Aries Electronics	CONN SOCKET SIP 18POS GOLD		0513	Active	Bulk	Through Hole	Solder	-	SIP	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	18 (1 x 18)	Beryllium Copper	10.0µin (0.25µm)	Brass
	18-0513-10T	RFQ VIEW	PDF RFQ	3,834 In-stock	Aries Electronics	CONN SOCKET SIP 18POS GOLD		0513	Active	Bulk	Through Hole	Solder	-	SIP	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	18 (1 x 18)	Beryllium Copper	200.0µin (5.08µm)	Brass
	18-0513-11H	RFQ VIEW	PDF RFQ	3,666 In-stock	Aries Electronics	CONN SOCKET SIP 18POS GOLD		0513	Active	Bulk	Through Hole	Solder	-	SIP	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	18 (1 x 18)	Beryllium Copper	10.0µin (0.25µm)	Brass
	18-0513-10	RFQ VIEW	PDF RFQ	2,426 In-stock	Aries Electronics	CONN SOCKET SIP 18POS GOLD		0513	Active	Bulk	Through Hole	Solder	-	SIP	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	18 (1 x 18)	Beryllium Copper	200.0µin (5.08µm)	Brass

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