Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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Aries Electronics CONN SOCKET SIP 16POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (1 x 16) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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1,873
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Aries Electronics CONN SOCKET SIP 16POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (1 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
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645
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Aries Electronics CONN SOCKET SIP 16POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (1 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
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1,233
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Aries Electronics CONN SOCKET SIP 16POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (1 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
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2,109
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Aries Electronics CONN SOCKET SIP 16POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 16 (1 x 16) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,199
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Aries Electronics CONN SOCKET SIP 16POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 16 (1 x 16) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,945
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Aries Electronics CONN SOCKET SIP 16POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 16 (1 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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612
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Aries Electronics CONN SOCKET SIP 16POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 16 (1 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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1,514
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Aries Electronics CONN SOCKET SIP 16POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (1 x 16) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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3,301
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Aries Electronics CONN SOCKET SIP 16POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (1 x 16) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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1,394
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Harwin Inc. CONN SOCKET SIP 16POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 16 (1 x 16) Beryllium Copper 196.9µin (5.00µm) Brass
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812
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Aries Electronics CONN SOCKET SIP 16POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (1 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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1,038
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Aries Electronics CONN SOCKET SIP 16POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (1 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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1,137
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Aries Electronics CONN SOCKET SIP 16POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (1 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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2,227
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Harwin Inc. CONN SOCKET SIP 16POS GOLD D01-995 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (1 x 16) Beryllium Copper 196.9µin (5.00µm) Brass
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3,607
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Aries Electronics CONN SOCKET SIP 16POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (1 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
317-43-116-41-005000
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880
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Mill-Max Manufacturing Corp. CONN SOCKET 16POS .070 STR GOLD 317 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin 16 (1 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,343
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Aries Electronics CONN SOCKET SIP 16POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 16 (1 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
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2,428
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Aries Electronics CONN SOCKET SIP 16POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 16 (1 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
317-47-116-41-005000
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1,920
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 16POS GOLD 317 Active Tube -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold Flash Tin 16 (1 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,124
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Aries Electronics CONN SOCKET SIP 16POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (1 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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3,182
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Aries Electronics CONN SOCKET SIP 16POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (1 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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1,098
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Aries Electronics CONN SOCKET SIP 16POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 50.0µin (1.27µm) Tin 16 (1 x 16) Phosphor Bronze 50.0µin (1.27µm) Phosphor Bronze
346-43-116-41-013000
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1,834
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 16POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 16 (1 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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830
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Aries Electronics CONN SOCKET SIP 16POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (1 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
346-93-116-41-013000
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2,975
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 16POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 16 (1 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy