Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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Aries Electronics CONN SOCKET SIP 3POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 3 (1 x 3) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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1,709
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Aries Electronics CONN SOCKET SIP 3POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 3 (1 x 3) Beryllium Copper 10.0µin (0.25µm) Brass
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1,972
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Aries Electronics CONN SOCKET SIP 3POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 3 (1 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
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3,654
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Aries Electronics CONN SOCKET SIP 3POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 3 (1 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
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3,426
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Aries Electronics CONN SOCKET SIP 3POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 3 (1 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
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3,961
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Aries Electronics CONN SOCKET SIP 3POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 3 (1 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
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3,837
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Aries Electronics CONN SOCKET SIP 3POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 3 (1 x 3) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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1,967
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Aries Electronics CONN SOCKET SIP 3POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 3 (1 x 3) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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1,361
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Aries Electronics CONN SOCKET SIP 3POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 3 (1 x 3) Beryllium Copper 10.0µin (0.25µm) Brass
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755
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Aries Electronics CONN SOCKET SIP 3POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 3 (1 x 3) Beryllium Copper 10.0µin (0.25µm) Brass
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2,258
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Aries Electronics CONN SOCKET SIP 3POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 3 (1 x 3) Beryllium Copper 10.0µin (0.25µm) Brass
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901
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Aries Electronics CONN SOCKET SIP 3POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 3 (1 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
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3,693
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Aries Electronics CONN SOCKET SIP 3POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 3 (1 x 3) Beryllium Copper 10.0µin (0.25µm) Brass
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2,574
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Aries Electronics CONN SOCKET SIP 3POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 3 (1 x 3) Beryllium Copper 10.0µin (0.25µm) Brass
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2,281
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Aries Electronics CONN SOCKET SIP 3POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 3 (1 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
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2,048
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Aries Electronics CONN SOCKET SIP 3POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 3 (1 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
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3,149
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Aries Electronics CONN SOCKET SIP 3POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 3 (1 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
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3,627
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 3POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 3 (1 x 3) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper