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- Plastic (1)
- Polyamide (PA46), Nylon 4/6, Glass Filled (8)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (1)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (14)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (16)
- Polyester (2)
- Polyester, Glass Filled (1)
- Thermoplastic, Polyester (1)
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44 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
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VIEW |
3,921
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 64 (2 x 32) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
3,097
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS GOLD | 115 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
2,794
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,109
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
1,627
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 64POS GOLD | 800 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | Flash | - | 64 (2 x 32) | Copper Alloy | - | - | |||
|
VIEW |
2,817
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,121
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
2,055
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 64POS GOLD | D8864 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.75" (19.05mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.070" (1.78mm) | Gold | Flash | Tin | 64 (2 x 32) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
3,947
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 64POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 64 (2 x 32) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
3,189
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,329
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 64POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 64 (2 x 32) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,755
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 64POS GOLD | 117 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.070" (1.78mm) | Gold | Flash | Tin | 64 (2 x 32) | Beryllium Copper | - | Brass | |||
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|
VIEW |
2,587
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS GOLD | 111 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
3,085
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 64POS GOLD | 800 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | - | 64 (2 x 32) | Copper Alloy | - | - | |||
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|
VIEW |
1,949
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
2,660
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,216
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 64POS GOLD | 117 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.75" (19.05mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.070" (1.78mm) | Gold | 29.5µin (0.75µm) | Tin | 64 (2 x 32) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,504
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 64POS GOLD | 117 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.070" (1.78mm) | Gold | 29.5µin (0.75µm) | Tin | 64 (2 x 32) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
3,772
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 64 (2 x 32) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,894
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 64POS GOLD | 800 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 64 (2 x 32) | Beryllium Copper | 20.0µin (0.51µm) | Copper | |||
|
|
VIEW |
1,150
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
3,333
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS TIN | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | Tin | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
3,249
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS TINLEAD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Tin-Lead | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
1,601
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 64POS GOLD | 117 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.75" (19.05mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.070" (1.78mm) | Gold | Flash | Tin | 64 (2 x 32) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,128
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 64POS GOLD | 117 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.75" (19.05mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.070" (1.78mm) | Gold | Flash | Tin | 64 (2 x 32) | Beryllium Copper | - | Brass | |||
|
VIEW |
835
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 64POS GOLD | 117 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.070" (1.78mm) | Gold | Flash | Tin | 64 (2 x 32) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,371
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 64POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 64 (2 x 32) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
3,571
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 64POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 64 (2 x 32) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,524
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS GOLD | 117 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | Tin | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
1,471
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | Flash | Tin | 64 (2 x 32) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
