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56 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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GLOBAL STOCKS | ||||||||||||||||||||||||
VIEW |
3,073
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS TIN | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 8 (2 x 4) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | ||||
VIEW |
2,839
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS TIN | 501 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 8 (2 x 4) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | ||||
VIEW |
3,988
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
1,026
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
1,130
In-stock
|
Samtec Inc. | CONN IC DIP SOCKET 8POS GOLD | ICO | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | ||||
VIEW |
875
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
2,795
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
2,453
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 8POS GOLD | 612 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | ||||
VIEW |
3,031
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 8POS GOLD | 614 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | ||||
VIEW |
1,817
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 8POS GOLD | 614 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | ||||
VIEW |
3,228
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 8POS GOLD | 612 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | ||||
VIEW |
2,042
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 8POS GOLD | 614 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | ||||
VIEW |
2,732
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | ||||
VIEW |
2,159
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | ||||
VIEW |
3,844
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
3,718
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
1,945
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 8 (2 x 4) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | ||||
VIEW |
3,331
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | ||||
VIEW |
3,239
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
850
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS TIN | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 8 (2 x 4) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | ||||
VIEW |
1,455
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS TIN | 501 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 8 (2 x 4) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | ||||
VIEW |
2,340
In-stock
|
Samtec Inc. | CONN IC DIP SOCKET 8POS GOLD | ICA | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | ||||
VIEW |
1,685
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS TIN | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 8 (2 x 4) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | ||||
VIEW |
930
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS TIN | 501 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 8 (2 x 4) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | ||||
VIEW |
1,816
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
1,799
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
1,558
In-stock
|
Samtec Inc. | CONN IC DIP SOCKET 8POS TIN | ICA | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | ||||
VIEW |
2,782
In-stock
|
Samtec Inc. | CONN IC DIP SOCKET 8POS TIN | ICO | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 8 (2 x 4) | Beryllium Copper | - | Brass | ||||
VIEW |
719
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
680
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Brass |