Series :
Contact Finish Thickness - Mating :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
GLOBAL STOCKS
Default Photo
RFQ
VIEW
RFQ
633
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
1,416
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
2,127
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
3,685
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
3,768
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
3,805
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
1,619
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 48 (2 x 24) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
3,611
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 48 (2 x 24) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
1,552
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 48 (2 x 24) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
1,991
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
2,384
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
3,109
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
3,054
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
2,721
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper
48-6574-11
RFQ
VIEW
RFQ
2,724
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
1,245
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
1,120
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
3,518
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper
48-6574-10
RFQ
VIEW
RFQ
3,444
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper
48-6554-11
RFQ
VIEW
RFQ
1,448
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 48 (2 x 24) Beryllium Copper