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20 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||
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VIEW |
3,991
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
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VIEW |
3,977
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 32POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 32 (2 x 16) | Beryllium Copper | |||
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VIEW |
1,128
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
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VIEW |
3,529
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
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|
VIEW |
3,565
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 32POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 32 (2 x 16) | Beryllium Copper | |||
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|
VIEW |
3,813
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
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|
VIEW |
2,770
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
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|
VIEW |
3,516
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
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|
VIEW |
2,830
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 32POS | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 32 (2 x 16) | Beryllium Nickel | |||
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|
VIEW |
3,100
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 32POS | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | 32 (2 x 16) | Beryllium Nickel | |||
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|
VIEW |
2,544
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
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|
VIEW |
848
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
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|
VIEW |
3,226
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
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|
VIEW |
3,266
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
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|
VIEW |
3,087
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
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VIEW |
1,318
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
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VIEW |
2,738
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
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VIEW |
3,356
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
|
VIEW |
3,227
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
|
VIEW |
2,166
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 32POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Beryllium Copper | |||
