Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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Aries Electronics CONN SOCKET SIP 36POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 36 (1 x 36) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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3,183
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Aries Electronics CONN SOCKET SIP 36POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 36 (1 x 36) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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1,337
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Aries Electronics CONN SOCKET SIP 36POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 36 (1 x 36) Beryllium Copper 200.0µin (5.08µm) Brass
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1,233
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Aries Electronics CONN SOCKET SIP 36POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 36 (1 x 36) Beryllium Copper 200.0µin (5.08µm) Brass
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1,234
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Aries Electronics CONN SOCKET SIP 36POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 36 (1 x 36) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
714-43-136-31-018000
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991
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 36POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 36 (1 x 36) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
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2,091
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Aries Electronics CONN SOCKET SIP 36POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 36 (1 x 36) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
346-93-136-41-013000
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833
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 36POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 36 (1 x 36) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,562
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Aries Electronics CONN SOCKET SIP 36POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 36 (1 x 36) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,976
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Aries Electronics CONN SOCKET SIP 36POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 36 (1 x 36) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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874
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Aries Electronics CONN SOCKET SIP 36POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 36 (1 x 36) Beryllium Copper 10.0µin (0.25µm) Brass
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1,284
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Aries Electronics CONN SOCKET SIP 36POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 36 (1 x 36) Beryllium Copper 10.0µin (0.25µm) Brass
346-43-136-41-013000
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2,436
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 36POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 36 (1 x 36) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,084
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Aries Electronics CONN SOCKET SIP 36POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 36 (1 x 36) Beryllium Copper 10.0µin (0.25µm) Brass
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3,060
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Aries Electronics CONN SOCKET SIP 36POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 36 (1 x 36) Beryllium Copper 10.0µin (0.25µm) Brass
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2,279
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Aries Electronics CONN SOCKET SIP 36POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 50.0µin (1.27µm) Tin 36 (1 x 36) Phosphor Bronze 50.0µin (1.27µm) Phosphor Bronze
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3,555
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Aries Electronics CONN SOCKET SIP 36POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 36 (1 x 36) Beryllium Copper 200.0µin (5.08µm) Brass
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3,160
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Aries Electronics CONN SOCKET SIP 36POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 36 (1 x 36) Beryllium Copper 200.0µin (5.08µm) Brass
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1,673
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Aries Electronics CONN SOCKET SIP 36POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 36 (1 x 36) Beryllium Copper 200.0µin (5.08µm) Brass