Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
Default Photo
RFQ
VIEW
RFQ
2,931
In-stock
Aries Electronics CONN SOCKET SIP 26POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 26 (1 x 26) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
1,080
In-stock
Aries Electronics CONN SOCKET SIP 26POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 26 (1 x 26) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
3,785
In-stock
Aries Electronics CONN SOCKET SIP 26POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 26 (1 x 26) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
2,939
In-stock
Aries Electronics CONN SOCKET SIP 26POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 26 (1 x 26) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
2,573
In-stock
Aries Electronics CONN SOCKET SIP 26POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 26 (1 x 26) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
3,979
In-stock
Aries Electronics CONN SOCKET SIP 26POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 26 (1 x 26) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
3,325
In-stock
Aries Electronics CONN SOCKET SIP 26POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 26 (1 x 26) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
1,731
In-stock
Aries Electronics CONN SOCKET SIP 26POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 26 (1 x 26) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
1,784
In-stock
Aries Electronics CONN SOCKET SIP 26POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 26 (1 x 26) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
346-43-126-41-013000
RFQ
VIEW
RFQ
3,699
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 26POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 26 (1 x 26) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
346-93-126-41-013000
RFQ
VIEW
RFQ
3,385
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 26POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 26 (1 x 26) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
2,395
In-stock
Aries Electronics CONN SOCKET SIP 26POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 26 (1 x 26) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
2,558
In-stock
Aries Electronics CONN SOCKET SIP 26POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 26 (1 x 26) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
3,619
In-stock
Aries Electronics CONN SOCKET SIP 26POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 26 (1 x 26) Beryllium Copper 200.0µin (5.08µm) Brass