Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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811
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Aries Electronics CONN SOCKET SIP 3POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 3 (1 x 3) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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2,221
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Aries Electronics CONN SOCKET SIP 3POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 50.0µin (1.27µm) Tin 3 (1 x 3) Phosphor Bronze 50.0µin (1.27µm) Phosphor Bronze
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3,465
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Aries Electronics CONN SOCKET SIP 3POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 3 (1 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
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2,099
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Aries Electronics CONN SOCKET SIP 3POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 3 (1 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
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3,453
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Aries Electronics CONN SOCKET SIP 3POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 3 (1 x 3) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,458
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Aries Electronics CONN SOCKET SIP 3POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 3 (1 x 3) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,825
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Aries Electronics CONN SOCKET SIP 3POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 3 (1 x 3) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,726
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Aries Electronics CONN SOCKET SIP 3POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 3 (1 x 3) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,681
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Aries Electronics CONN SOCKET SIP 3POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 3 (1 x 3) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,709
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Aries Electronics CONN SOCKET SIP 3POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 3 (1 x 3) Beryllium Copper 10.0µin (0.25µm) Brass
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1,972
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Aries Electronics CONN SOCKET SIP 3POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 3 (1 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
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3,654
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Aries Electronics CONN SOCKET SIP 3POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 3 (1 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
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3,426
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Aries Electronics CONN SOCKET SIP 3POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 3 (1 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
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3,961
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Aries Electronics CONN SOCKET SIP 3POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 3 (1 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
714-43-103-31-018000
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3,149
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 3POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 3 (1 x 3) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
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3,837
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Aries Electronics CONN SOCKET SIP 3POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 3 (1 x 3) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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1,967
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Aries Electronics CONN SOCKET SIP 3POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 3 (1 x 3) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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1,361
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Aries Electronics CONN SOCKET SIP 3POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 3 (1 x 3) Beryllium Copper 10.0µin (0.25µm) Brass
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755
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Aries Electronics CONN SOCKET SIP 3POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 3 (1 x 3) Beryllium Copper 10.0µin (0.25µm) Brass
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2,258
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Aries Electronics CONN SOCKET SIP 3POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 3 (1 x 3) Beryllium Copper 10.0µin (0.25µm) Brass
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901
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Aries Electronics CONN SOCKET SIP 3POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 3 (1 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
346-93-103-41-013000
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3,112
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 3POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 3 (1 x 3) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,693
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Aries Electronics CONN SOCKET SIP 3POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 3 (1 x 3) Beryllium Copper 10.0µin (0.25µm) Brass
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2,574
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Aries Electronics CONN SOCKET SIP 3POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 3 (1 x 3) Beryllium Copper 10.0µin (0.25µm) Brass
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1,861
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Aries Electronics CONN SOCKET SIP 3POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 3 (1 x 3) Beryllium Copper 10.0µin (0.25µm) Brass
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1,442
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Aries Electronics CONN SOCKET SIP 3POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 3 (1 x 3) Beryllium Copper 10.0µin (0.25µm) Brass
315-47-103-41-001000
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3,366
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 3POS GOLD 315 Active Tube -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 3 (1 x 3) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
315-47-103-41-003000
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2,666
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 3POS GOLD 315 Active Tube -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 3 (1 x 3) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,390
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 3POS GOLD 310 Active Tube -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 3 (1 x 3) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,496
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Aries Electronics CONN SOCKET SIP 3POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 3 (1 x 3) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze