Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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2,686
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Aries Electronics CONN SOCKET SIP 10POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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3,225
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Aries Electronics CONN SOCKET SIP 10POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
714-43-110-31-018000
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3,335
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 10POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10 (1 x 10) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
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2,008
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TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD 510 Active Tube - Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) Tin-Lead 10 (1 x 10) Beryllium Copper 20.0µin (0.51µm) Copper
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2,222
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Aries Electronics CONN SOCKET SIP 10POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10 (1 x 10) Beryllium Copper 10.0µin (0.25µm) Brass
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2,201
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Aries Electronics CONN SOCKET SIP 10POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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2,428
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Aries Electronics CONN SOCKET SIP 10POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10 (1 x 10) Beryllium Copper 10.0µin (0.25µm) Brass
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3,635
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Aries Electronics CONN SOCKET SIP 10POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10 (1 x 10) Beryllium Copper 10.0µin (0.25µm) Brass
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3,676
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Aries Electronics CONN SOCKET SIP 10POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10 (1 x 10) Beryllium Copper 10.0µin (0.25µm) Brass
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3,620
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Aries Electronics CONN SOCKET SIP 10POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10 (1 x 10) Beryllium Copper 10.0µin (0.25µm) Brass
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3,537
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TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD - Active Bulk - Through Hole Solder Closed Frame SIP Thermoplastic 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 10 (1 x 10) Beryllium Copper - Brass
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3,859
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Harwin Inc. CONN SOCKET SIP 10POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 10 (1 x 10) Beryllium Copper 196.9µin (5.00µm) Brass
510-AG90D-10
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3,203
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TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD 500 Active Bulk - Through Hole Solder - SIP Thermoplastic 0.100" (2.54mm) Gold - Gold 10 (1 x 10) Beryllium Copper - Beryllium Copper
1-1571994-0
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1,957
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TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD 510 Active Bulk - Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) Tin 10 (1 x 10) Beryllium Copper 20.0µin (0.51µm) Copper
346-43-110-41-013000
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2,633
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 10POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,428
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Aries Electronics CONN SOCKET SIP 10POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10 (1 x 10) Beryllium Copper 10.0µin (0.25µm) Brass
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1,668
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TE Connectivity AMP Connectors CONN SOCKET SIP 10POS TIN-LEAD - Active Bulk - Through Hole Solder - SIP Thermoplastic 0.100" (2.54mm) Tin-Lead - Tin-Lead 10 (1 x 10) Beryllium Copper - Beryllium Copper
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1,265
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Aries Electronics CONN SOCKET SIP 10POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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947
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Aries Electronics CONN SOCKET SIP 10POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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3,255
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TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD - Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 29.5µin (0.75µm) Gold 10 (1 x 10) Beryllium Copper 29.5µin (0.75µm) Brass
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2,288
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD - Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold Flash Tin 10 (1 x 10) Beryllium Copper 196.9µin (5.00µm) Brass
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1,690
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Aries Electronics CONN SOCKET SIP 10POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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1,120
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Aries Electronics CONN SOCKET SIP 10POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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1,790
In-stock
Aries Electronics CONN SOCKET SIP 10POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10 (1 x 10) Beryllium Copper 10.0µin (0.25µm) Brass
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2,251
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TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD - Active Tube - Through Hole Solder Closed Frame SIP Thermoplastic 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (1 x 10) Beryllium Copper 30.0µin (0.76µm) Brass
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1,038
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Aries Electronics CONN SOCKET SIP 10POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10 (1 x 10) Beryllium Copper 10.0µin (0.25µm) Brass
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3,371
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Harwin Inc. CONN SOCKET SIP 10POS GOLD D01-995 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (1 x 10) Beryllium Copper 196.9µin (5.00µm) Brass
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3,947
In-stock
Aries Electronics CONN SOCKET SIP 10POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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3,156
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TE Connectivity AMP Connectors CONN SOCKET SIP 10POS TIN Diplomate DL Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 10 (1 x 10) Beryllium Copper - Beryllium Copper
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2,623
In-stock
Aries Electronics CONN SOCKET SIP 10POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (1 x 10) Beryllium Copper 200.0µin (5.08µm) Brass