- Series :
- Operating Temperature :
- Termination :
- Contact Finish - Mating :
- Contact Finish Thickness - Mating :
- Number of Positions or Pins (Grid) :
- Contact Finish Thickness - Post :
- Contact Material - Post :
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29 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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GLOBAL STOCKS | ||||||||||||||||||||||||
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VIEW |
1,471
In-stock
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TE Connectivity AMP Connectors | CONN SOCKET SIP 20POS GOLD | 500 | Active | Bulk | - | Through Hole | Solder | Closed Frame | SIP | - | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (1 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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VIEW |
3,427
In-stock
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 20POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (1 x 20) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
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VIEW |
1,176
In-stock
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TE Connectivity AMP Connectors | CONN SOCKET SIP 20POS GOLD | - | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 20 (1 x 20) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
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VIEW |
3,026
In-stock
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 20POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (1 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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VIEW |
1,604
In-stock
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TE Connectivity AMP Connectors | CONN SOCKET SIP 20POS TIN | 510 | Active | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | Tin | 20 (2 x 10) | Beryllium Copper | 20.0µin (0.51µm) | Copper | |||
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VIEW |
1,845
In-stock
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TE Connectivity AMP Connectors | CONN SOCKET SIP 16POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Thermoplastic | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 16 (1 x 16) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
3,269
In-stock
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TE Connectivity AMP Connectors | CONN SOCKET SIP 16POS GOLD | - | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | Flash | Tin | 16 (1 x 16) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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VIEW |
3,537
In-stock
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TE Connectivity AMP Connectors | CONN SOCKET SIP 10POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Thermoplastic | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 10 (1 x 10) | Beryllium Copper | - | Brass | |||
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VIEW |
2,585
In-stock
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 32POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 32 (1 x 32) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
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VIEW |
1,957
In-stock
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TE Connectivity AMP Connectors | CONN SOCKET SIP 10POS GOLD | 510 | Active | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Tin | 10 (1 x 10) | Beryllium Copper | 20.0µin (0.51µm) | Copper | |||
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VIEW |
3,584
In-stock
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 15POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 15 (1 x 15) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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VIEW |
1,586
In-stock
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 20POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (1 x 20) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
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VIEW |
1,886
In-stock
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TE Connectivity AMP Connectors | CONN SOCKET SIP 12POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Tin | 12 (1 x 12) | Beryllium Copper | 20.0µin (0.51µm) | Copper | |||
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VIEW |
676
In-stock
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 16POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 16 (1 x 16) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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VIEW |
881
In-stock
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TE Connectivity AMP Connectors | CONN SOCKET SIP 7POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Thermoplastic | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 7 (1 x 7) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
3,483
In-stock
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TE Connectivity AMP Connectors | CONN SOCKET SIP 20POS GOLD | 500 | Active | Bulk | - | Through Hole | Solder | Closed Frame | SIP | - | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (1 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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VIEW |
3,786
In-stock
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TE Connectivity AMP Connectors | CONN SOCKET SIP 14POS GOLD | - | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 14 (1 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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VIEW |
975
In-stock
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 15POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 15 (1 x 15) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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VIEW |
3,850
In-stock
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 20POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (1 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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VIEW |
3,988
In-stock
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TE Connectivity AMP Connectors | CONN SOCKET SIP 20POS GOLD | 510 | Active | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Tin | 20 (1 x 20) | Beryllium Copper | 20.0µin (0.51µm) | Copper | |||
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VIEW |
3,255
In-stock
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TE Connectivity AMP Connectors | CONN SOCKET SIP 10POS GOLD | - | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Gold | 10 (1 x 10) | Beryllium Copper | 29.5µin (0.75µm) | Brass | |||
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VIEW |
3,130
In-stock
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TE Connectivity AMP Connectors | CONN SOCKET SIP 11POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Closed Frame | SIP | - | - | Gold | 10.0µin (0.25µm) | Gold | 11 (1 x 11) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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VIEW |
2,288
In-stock
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TE Connectivity AMP Connectors | CONN SOCKET SIP 10POS GOLD | - | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | Flash | Tin | 10 (1 x 10) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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VIEW |
3,477
In-stock
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TE Connectivity AMP Connectors | CONN SOCKET SIP 20POS GOLD | - | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | Flash | Tin | 20 (1 x 20) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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VIEW |
2,495
In-stock
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TE Connectivity AMP Connectors | CONN SOCKET SIP 20POS TINLEAD | - | Active | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Thermoplastic | 0.100" (2.54mm) | Tin-Lead | - | Tin-Lead | 20 (1 x 20) | Beryllium Copper | - | Brass | |||
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VIEW |
1,583
In-stock
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TE Connectivity AMP Connectors | CONN SOCKET SIP 2POS GOLD | 510 | Active | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Tin | 2 (1 x 2) | Beryllium Copper | 20.0µin (0.51µm) | Copper | |||
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VIEW |
1,527
In-stock
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TE Connectivity AMP Connectors | CONN SOCKET SIP 5POS GOLD | - | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | Flash | Tin | 5 (1 x 5) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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VIEW |
3,627
In-stock
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 3POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 3 (1 x 3) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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VIEW |
1,262
In-stock
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Apex Microtechnology | CONN SOCKET SIP 20POS GOLD | Apex Precision Power® | Active | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 20 (1 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass |