Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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1,471
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TE Connectivity AMP Connectors CONN SOCKET SIP 20POS GOLD 500 Active Bulk - Through Hole Solder Closed Frame SIP - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (1 x 20) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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3,427
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 20 (1 x 20) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
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1,176
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TE Connectivity AMP Connectors CONN SOCKET SIP 20POS GOLD - Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (1 x 20) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
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3,026
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (1 x 20) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
2-1571995-0
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1,604
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TE Connectivity AMP Connectors CONN SOCKET SIP 20POS TIN 510 Active Bulk - Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Tin - Tin 20 (2 x 10) Beryllium Copper 20.0µin (0.51µm) Copper
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1,845
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TE Connectivity AMP Connectors CONN SOCKET SIP 16POS GOLD - Active Bulk - Through Hole Solder Closed Frame SIP Thermoplastic 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 16 (1 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
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3,269
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TE Connectivity AMP Connectors CONN SOCKET SIP 16POS GOLD - Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold Flash Tin 16 (1 x 16) Beryllium Copper 196.9µin (5.00µm) Brass
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3,537
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TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD - Active Bulk - Through Hole Solder Closed Frame SIP Thermoplastic 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 10 (1 x 10) Beryllium Copper - Brass
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2,585
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 32POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 32 (1 x 32) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
1-1571994-0
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1,957
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TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD 510 Active Bulk - Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) Tin 10 (1 x 10) Beryllium Copper 20.0µin (0.51µm) Copper
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3,584
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 15POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 15 (1 x 15) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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1,586
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 20 (1 x 20) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
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1,886
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TE Connectivity AMP Connectors CONN SOCKET SIP 12POS GOLD - Active Bulk - Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) Tin 12 (1 x 12) Beryllium Copper 20.0µin (0.51µm) Copper
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676
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 16POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 16 (1 x 16) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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881
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TE Connectivity AMP Connectors CONN SOCKET SIP 7POS GOLD - Active Bulk - Through Hole Solder Closed Frame SIP Thermoplastic 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 7 (1 x 7) Beryllium Copper 10.0µin (0.25µm) Brass
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3,483
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TE Connectivity AMP Connectors CONN SOCKET SIP 20POS GOLD 500 Active Bulk - Through Hole Solder Closed Frame SIP - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (1 x 20) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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3,786
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TE Connectivity AMP Connectors CONN SOCKET SIP 14POS GOLD - Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 14 (1 x 14) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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975
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 15POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 15 (1 x 15) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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3,850
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (1 x 20) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
2-1571994-0
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RFQ
3,988
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 20POS GOLD 510 Active Bulk - Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) Tin 20 (1 x 20) Beryllium Copper 20.0µin (0.51µm) Copper
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3,255
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TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD - Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 29.5µin (0.75µm) Gold 10 (1 x 10) Beryllium Copper 29.5µin (0.75µm) Brass
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3,130
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TE Connectivity AMP Connectors CONN SOCKET SIP 11POS GOLD - Active Bulk - Through Hole Solder Closed Frame SIP - - Gold 10.0µin (0.25µm) Gold 11 (1 x 11) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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2,288
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TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD - Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold Flash Tin 10 (1 x 10) Beryllium Copper 196.9µin (5.00µm) Brass
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3,477
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TE Connectivity AMP Connectors CONN SOCKET SIP 20POS GOLD - Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold Flash Tin 20 (1 x 20) Beryllium Copper 196.9µin (5.00µm) Brass
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2,495
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TE Connectivity AMP Connectors CONN SOCKET SIP 20POS TINLEAD - Active Bulk - Through Hole Solder Closed Frame SIP Thermoplastic 0.100" (2.54mm) Tin-Lead - Tin-Lead 20 (1 x 20) Beryllium Copper - Brass
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1,583
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TE Connectivity AMP Connectors CONN SOCKET SIP 2POS GOLD 510 Active Bulk - Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) Tin 2 (1 x 2) Beryllium Copper 20.0µin (0.51µm) Copper
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1,527
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TE Connectivity AMP Connectors CONN SOCKET SIP 5POS GOLD - Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold Flash Tin 5 (1 x 5) Beryllium Copper 196.9µin (5.00µm) Brass
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3,627
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 3POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 3 (1 x 3) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
MS06
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1,262
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Apex Microtechnology CONN SOCKET SIP 20POS GOLD Apex Precision Power® Active Bulk - Through Hole Solder Closed Frame SIP Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 20 (1 x 20) Beryllium Copper 200.0µin (5.08µm) Brass