- Packaging :
- Operating Temperature :
- Termination :
- Features :
- Type :
-
- BGA (24)
- DIP, 0.2" (5.08mm) Row Spacing (235)
- DIP, 0.3" (7.62mm) Row Spacing (352)
- DIP, 0.4" (10.16mm) Row Spacing (51)
- DIP, 0.6" (15.24mm) Row Spacing (321)
- DIP, 0.75" (19.05mm) Row Spacing (1)
- DIP, 0.9" (22.86mm) Row Spacing (92)
- DIP, ZIF (ZIP) (13)
- DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing (48)
- DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing (31)
- PGA (159)
- SIP (512)
- Zig-Zag (1)
- Housing Material :
-
- FR4 Epoxy Glass (48)
- Polyamide (PA46), Nylon 4/6 (241)
- Polyamide (PA46), Nylon 4/6, Glass Filled (1304)
- Polybutylene Terephthalate (PBT) (11)
- Polybutylene Terephthalate (PBT), Glass Filled (16)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (37)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (38)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (28)
- Polyester (4)
- Polyester, Glass Filled (13)
- Polyphenylene Sulfide (PPS), Glass Filled (79)
- Thermoplastic (5)
- Thermoplastic, Polyester (11)
- Thermoplastic, Polyester, Glass Filled (2)
- Pitch - Mating :
- Contact Finish - Post :
- Number of Positions or Pins (Grid) :
-
- 1 (1 x 1) (14)
- 10 (1 x 10) (16)
- 10 (2 x 5) (50)
- 100 (15 x 15) (1)
- 11 (1 x 11) (15)
- 114 (13 x 13) (1)
- 12 (1 x 12) (15)
- 12 (2 x 6) (30)
- 121 (13 x 13) (1)
- 124 (13 x 13) (1)
- 13 (1 x 13) (15)
- 132 (13 x 13) (1)
- 132 (14 x 14) (1)
- 133 (14 x 14) (1)
- 14 (1 x 14) (15)
- 14 (2 x 7) (63)
- 144 (12 x 12) (1)
- 144 (15 x 15) (1)
- 145 (15 x 15) (1)
- 149 (15 x 15) (1)
- 15 (1 x 15) (16)
- 16 (1 x 16) (18)
- 16 (2 x 8) (66)
- 169 (17 x 17) (1)
- 17 (1 x 17) (14)
- 18 (1 x 18) (15)
- 18 (2 x 9) (48)
- 19 (1 x 19) (14)
- 191 (18 x 18) (1)
- 192 (16 x 16) (2)
- 2 (1 x 2) (28)
- 20 (1 x 20) (19)
- 20 (2 x 10) (67)
- 209 (17 x 17) (1)
- 21 (1 x 21) (14)
- 22 (1 x 22) (14)
- 22 (2 x 11) (47)
- 225 (18 x 18) (1)
- 23 (1 x 23) (14)
- 24 (1 x 24) (14)
- 24 (2 x 12) (113)
- 241 (18 x 18) (1)
- 25 (1 x 25) (13)
- 255 (16 x 16) (2)
- 256 (16 x 16) (2)
- 256 (20 x 20) (2)
- 26 (1 x 26) (9)
- 26 (2 x 13) (21)
- 27 (1 x 27) (9)
- 272 (20 x 20) (2)
- 28 (1 x 28) (9)
- 28 (2 x 14) (105)
- 29 (1 x 29) (8)
- 292 (20 x 20) (2)
- 296 (19 x 19) (1)
- 3 (1 x 3) (15)
- 30 (1 x 30) (9)
- 30 (2 x 15) (37)
- 31 (1 x 31) (9)
- 32 (1 x 32) (10)
- 32 (2 x 16) (87)
- 33 (1 x 33) (9)
- 34 (1 x 34) (9)
- 34 (2 x 17) (19)
- 35 (1 x 35) (9)
- 352 (26 x 26) (2)
- 356 (26 x 26) (2)
- 357 (19 x 19) (2)
- 36 (1 x 36) (9)
- 36 (2 x 18) (35)
- 360 (19 x 19) (2)
- 361 (18 x 18) (1)
- 37 (1 x 37) (9)
- 37 (10 x 10) (1)
- 38 (1 x 38) (9)
- 38 (2 x 19) (19)
- 381 (18 x 18) (1)
- 388 (26 x 26) (2)
- 39 (1 x 39) (9)
- 4 (1 x 4) (15)
- 4 (2 x 2) (13)
- 40 (1 x 40) (10)
- 40 (2 x 20) (93)
- 400 (20 x 20) (2)
- 42 (2 x 21) (10)
- 420 (26 x 26) (2)
- 432 (31 x 31) (2)
- 44 (2 x 22) (8)
- 456 (26 x 26) (2)
- 478 (26 x 26) (2)
- 48 (2 x 24) (41)
- 480 (29 x 29) (2)
- 5 (1 x 5) (15)
- 50 (2 x 25) (18)
- 500 (30 x 30) (2)
- 504 (29 x 29) (2)
- 52 (2 x 26) (3)
- 520 (31 x 31) (2)
- 56 (2 x 28) (1)
- 56 (9 x 9) (1)
- 560 (33 x 33) (2)
- 576 (30 x 30) (2)
- 58 (2 x 29) (1)
- 6 (1 x 6) (15)
- 6 (2 x 3) (48)
- 60 (2 x 30) (9)
- 600 (35 x 35) (2)
- 64 (2 x 32) (19)
- 652 (35 x 35) (2)
- 68 (10 x 10) (1)
- 68 (11 x 11) (2)
- 69 (11 x 11) (2)
- 7 (1 x 7) (16)
- 72 (11 x 11) (1)
- 8 (1 x 8) (15)
- 8 (2 x 4) (60)
- 84 (10 x 10) (1)
- 84 (13 x 13) (1)
- 9 (1 x 9) (15)
- Contact Finish Thickness - Post :
- Contact Material - Post :
- Applied Filters :
1840 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
3,252
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
|
VIEW |
2,467
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 652 (35 x 35) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
3,345
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 600 (35 x 35) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
2,836
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 576 (30 x 30) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,541
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 520 (31 x 31) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,295
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 560 (33 x 33) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,927
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 504 (29 x 29) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
2,073
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 500 (30 x 30) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
2,486
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 480 (29 x 29) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,232
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 478 (26 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
2,079
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 456 (26 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
633
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
|
VIEW |
1,416
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
|
VIEW |
1,231
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 432 (31 x 31) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,125
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 652 (35 x 35) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
3,763
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 420 (26 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,371
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 400 (20 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,242
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 600 (35 x 35) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
849
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 388 (26 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,343
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 576 (30 x 30) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
975
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 560 (33 x 33) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,172
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 272 (20 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,478
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PG | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,682
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 256 (16 x 16) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,409
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 256 (20 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
3,721
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 192 (16 x 16) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
2,127
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
|
VIEW |
3,685
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
|
VIEW |
3,768
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
|
VIEW |
3,805
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper |