Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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3,107
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Aries Electronics CONN SOCKET SIP 37POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 37 (1 x 37) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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2,222
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Aries Electronics CONN SOCKET SIP 37POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 37 (1 x 37) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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1,100
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Aries Electronics CONN SOCKET SIP 37POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 37 (1 x 37) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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3,809
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Aries Electronics CONN SOCKET SIP 37POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 37 (1 x 37) Beryllium Copper 200.0µin (5.08µm) Brass
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867
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Aries Electronics CONN SOCKET SIP 37POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 37 (1 x 37) Beryllium Copper 200.0µin (5.08µm) Brass
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3,066
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Aries Electronics CONN SOCKET SIP 37POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 37 (1 x 37) Beryllium Copper 10.0µin (0.25µm) Brass
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1,675
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Aries Electronics CONN SOCKET SIP 37POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 37 (1 x 37) Beryllium Copper 200.0µin (5.08µm) Brass
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2,769
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Aries Electronics CONN SOCKET SIP 37POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 37 (1 x 37) Beryllium Copper 200.0µin (5.08µm) Brass
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2,795
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Aries Electronics CONN SOCKET SIP 37POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 37 (1 x 37) Beryllium Copper 10.0µin (0.25µm) Brass
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2,552
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Aries Electronics CONN SOCKET SIP 37POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 37 (1 x 37) Beryllium Copper 10.0µin (0.25µm) Brass
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1,370
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Aries Electronics CONN SOCKET SIP 37POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 37 (1 x 37) Beryllium Copper 10.0µin (0.25µm) Brass
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2,400
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Aries Electronics CONN SOCKET SIP 37POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 37 (1 x 37) Beryllium Copper 200.0µin (5.08µm) Brass