Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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Aries Electronics CONN SOCKET SIP 13POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 13 (1 x 13) Beryllium Copper 10.0µin (0.25µm) Brass
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849
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Aries Electronics CONN SOCKET SIP 13POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 13 (1 x 13) Beryllium Copper 10.0µin (0.25µm) Brass
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1,626
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Aries Electronics CONN SOCKET SIP 13POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 13 (1 x 13) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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656
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Aries Electronics CONN SOCKET SIP 13POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 13 (1 x 13) Beryllium Copper 10.0µin (0.25µm) Brass
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1,246
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Aries Electronics CONN SOCKET SIP 13POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 13 (1 x 13) Beryllium Copper 200.0µin (5.08µm) Brass
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3,669
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Aries Electronics CONN SOCKET SIP 13POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 13 (1 x 13) Beryllium Copper 200.0µin (5.08µm) Brass
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989
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Aries Electronics CONN SOCKET SIP 13POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 13 (1 x 13) Beryllium Copper 200.0µin (5.08µm) Brass
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1,845
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Aries Electronics CONN SOCKET SIP 13POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 13 (1 x 13) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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1,908
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Aries Electronics CONN SOCKET SIP 13POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 13 (1 x 13) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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2,508
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On Shore Technology Inc. CONN SOCKET SIP 13POS GOLD SBU Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 13 (1 x 13) Beryllium Copper 196.9µin (5.00µm) Brass
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2,898
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Aries Electronics CONN SOCKET SIP 13POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 13 (1 x 13) Beryllium Copper 200.0µin (5.08µm) Brass
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3,138
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Aries Electronics CONN SOCKET SIP 13POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 13 (1 x 13) Beryllium Copper 200.0µin (5.08µm) Brass
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1,786
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Aries Electronics CONN SOCKET SIP 13POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 13 (1 x 13) Beryllium Copper 10.0µin (0.25µm) Brass
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3,172
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Aries Electronics CONN SOCKET SIP 13POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 13 (1 x 13) Beryllium Copper 10.0µin (0.25µm) Brass
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3,865
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Aries Electronics CONN SOCKET SIP 13POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 13 (1 x 13) Beryllium Copper 10.0µin (0.25µm) Brass
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2,368
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Aries Electronics CONN SOCKET SIP 13POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 13 (1 x 13) Beryllium Copper 200.0µin (5.08µm) Brass
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1,834
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Aries Electronics CONN SOCKET SIP 13POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 13 (1 x 13) Beryllium Copper 200.0µin (5.08µm) Brass
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3,604
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Aries Electronics CONN SOCKET SIP 13POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 13 (1 x 13) Beryllium Copper 200.0µin (5.08µm) Brass