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10 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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GLOBAL STOCKS | ||||||||||||||||||||||||
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VIEW |
1,167
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 42 (2 x 21) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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VIEW |
2,098
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 42 (2 x 21) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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VIEW |
1,618
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 42 (2 x 21) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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VIEW |
1,519
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 42 (2 x 21) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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VIEW |
3,740
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 42 (2 x 21) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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VIEW |
3,941
In-stock
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Aries Electronics | CONN IC DIP SOCKET ZIF 42POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 42 (2 x 21) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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VIEW |
3,460
In-stock
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Aries Electronics | CONN IC DIP SOCKET 42POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 42 (2 x 21) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
2,690
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 42POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 42 (2 x 21) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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VIEW |
2,986
In-stock
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Aries Electronics | CONN IC DIP SOCKET 42POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 42 (2 x 21) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
2,352
In-stock
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Aries Electronics | CONN IC DIP SOCKET 42POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 42 (2 x 21) | Beryllium Copper | 200.0µin (5.08µm) | Brass |