Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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1,167
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Aries Electronics CONN IC DIP SOCKET ZIF 42POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 42 (2 x 21) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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2,098
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Aries Electronics CONN IC DIP SOCKET ZIF 42POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 42 (2 x 21) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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1,618
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Aries Electronics CONN IC DIP SOCKET ZIF 42POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 42 (2 x 21) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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1,519
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Aries Electronics CONN IC DIP SOCKET ZIF 42POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 42 (2 x 21) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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3,740
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Aries Electronics CONN IC DIP SOCKET ZIF 42POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 42 (2 x 21) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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3,941
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Aries Electronics CONN IC DIP SOCKET ZIF 42POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 42 (2 x 21) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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3,460
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Aries Electronics CONN IC DIP SOCKET 42POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Brass
110-91-642-41-001000
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2,690
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 42POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,986
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Aries Electronics CONN IC DIP SOCKET 42POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 42 (2 x 21) Beryllium Copper 10.0µin (0.25µm) Brass
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2,352
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Aries Electronics CONN IC DIP SOCKET 42POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Brass