Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
Default Photo
RFQ
VIEW
RFQ
3,000
In-stock
Aries Electronics CONN SOCKET SIP 40POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 40 (1 x 40) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
3,886
In-stock
Aries Electronics CONN SOCKET SIP 40POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 40 (1 x 40) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
828
In-stock
Aries Electronics CONN SOCKET SIP 40POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 40 (1 x 40) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
3,410
In-stock
Aries Electronics CONN SOCKET SIP 40POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (1 x 40) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
2,813
In-stock
Aries Electronics CONN SOCKET SIP 40POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (1 x 40) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
1,978
In-stock
Aries Electronics CONN SOCKET SIP 40POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 40 (1 x 40) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
RFQ
VIEW
RFQ
2,699
In-stock
Aries Electronics CONN SOCKET SIP 40POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 40 (1 x 40) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
RFQ
VIEW
RFQ
2,932
In-stock
Aries Electronics CONN SOCKET SIP 40POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (1 x 40) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
1,072
In-stock
Aries Electronics CONN SOCKET SIP 40POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 40 (1 x 40) Beryllium Copper 10.0µin (0.25µm) Brass
40-0518-11
RFQ
VIEW
RFQ
2,831
In-stock
Aries Electronics CONN SOCKET SIP 40POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 40 (1 x 40) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
RFQ
VIEW
RFQ
2,188
In-stock
Aries Electronics CONN SOCKET SIP 40POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (1 x 40) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
RFQ
VIEW
RFQ
1,933
In-stock
Aries Electronics CONN SOCKET SIP 40POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (1 x 40) Beryllium Copper 200.0µin (5.08µm) Brass
40-0518-10
RFQ
VIEW
RFQ
2,541
In-stock
Aries Electronics CONN SOCKET SIP 40POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (1 x 40) Beryllium Copper 200.0µin (5.08µm) Brass