- Packaging :
- Operating Temperature :
- Termination :
- Housing Material :
-
- Polyamide (PA46), Nylon 4/6 (4)
- Polyamide (PA46), Nylon 4/6, Glass Filled (92)
- Polybutylene Terephthalate (PBT) (1)
- Polybutylene Terephthalate (PBT), Glass Filled (1)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (4)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (3)
- Polyester, Glass Filled (1)
- Polyphenylene Sulfide (PPS), Glass Filled (8)
- Thermoplastic (2)
- Thermoplastic, Polyester (2)
- Contact Finish - Post :
- Contact Material - Mating :
- Contact Finish Thickness - Post :
- Contact Material - Post :
- Applied Filters :
118 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
1,282
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Spacer | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 24 (2 x 12) | Brass | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
720
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Spacer | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 24 (2 x 12) | Brass | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,687
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
3,856
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,087
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
2,778
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
612
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,656
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,654
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
3,813
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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|
VIEW |
1,537
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
2,617
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
776
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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|
VIEW |
2,488
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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|
VIEW |
1,421
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
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|
VIEW |
2,472
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 24POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
2,424
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | Correct-A-Chip® 1109800 | Active | Bulk | - | Through Hole | Solder | Programmable | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,124
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 24POS GOLD | 110 | Active | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
|
VIEW |
2,510
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 24POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
1,282
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 24POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
1,641
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 24POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
2,872
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
835
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,093
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,349
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,591
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
859
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,501
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.4" (10.16mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,479
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
3,036
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | |||
