- Series :
-
- 0513 (120)
- 110 (40)
- 500 (2)
- 501 (124)
- 503 (183)
- 508 (237)
- 511 (65)
- 516 (7)
- 518 (527)
- 550 (25)
- 57 (79)
- 700 Elevator Strip-Line™ (6)
- Correct-A-Chip® 1109800 (11)
- D0 (16)
- D01-995 (13)
- D26 (8)
- EJECT-A-DIP™ (95)
- ICA (10)
- ICO (5)
- Lo-PRO®file, 513 (244)
- Lo-PRO®file, 526 (6)
- PG (2)
- PGG (1)
- PGM (103)
- PKA (2)
- SBU (1)
- XR2 (15)
- Packaging :
- Operating Temperature :
- Termination :
- Type :
-
- DIP, 0.2" (5.08mm) Row Spacing (241)
- DIP, 0.3" (7.62mm) Row Spacing (375)
- DIP, 0.4" (10.16mm) Row Spacing (54)
- DIP, 0.6" (15.24mm) Row Spacing (372)
- DIP, 0.9" (22.86mm) Row Spacing (92)
- DIP, ZIF (ZIP) (13)
- DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing (48)
- DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing (31)
- PGA (135)
- SIP (625)
- Zig-Zag (1)
- Housing Material :
-
- Polyamide (PA46), Nylon 4/6 (237)
- Polyamide (PA46), Nylon 4/6, Glass Filled (1505)
- Polybutylene Terephthalate (PBT) (11)
- Polybutylene Terephthalate (PBT), Glass Filled (16)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (37)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (38)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (25)
- Polyester (4)
- Polyester, Glass Filled (12)
- Polyphenylene Sulfide (PPS), Glass Filled (79)
- Thermoplastic (5)
- Thermoplastic, Polyester (13)
- Thermoplastic, Polyester, Glass Filled (3)
- Contact Finish - Post :
- Number of Positions or Pins (Grid) :
-
- 1 (1 x 1) (5)
- 10 (1 x 10) (19)
- 10 (2 x 5) (56)
- 100 (15 x 15) (1)
- 11 (1 x 11) (17)
- 114 (13 x 13) (1)
- 12 (1 x 12) (18)
- 12 (2 x 6) (30)
- 121 (13 x 13) (1)
- 124 (13 x 13) (1)
- 13 (1 x 13) (18)
- 132 (13 x 13) (1)
- 132 (14 x 14) (1)
- 133 (14 x 14) (1)
- 14 (1 x 14) (18)
- 14 (2 x 7) (71)
- 144 (12 x 12) (1)
- 144 (15 x 15) (1)
- 145 (15 x 15) (1)
- 149 (15 x 15) (1)
- 15 (1 x 15) (19)
- 16 (1 x 16) (21)
- 16 (2 x 8) (74)
- 169 (17 x 17) (1)
- 17 (1 x 17) (17)
- 18 (1 x 18) (18)
- 18 (2 x 9) (54)
- 19 (1 x 19) (17)
- 191 (18 x 18) (1)
- 2 (1 x 2) (33)
- 20 (1 x 20) (24)
- 20 (2 x 10) (72)
- 209 (17 x 17) (1)
- 21 (1 x 21) (17)
- 22 (1 x 22) (17)
- 22 (2 x 11) (53)
- 225 (18 x 18) (1)
- 23 (1 x 23) (17)
- 24 (1 x 24) (17)
- 24 (2 x 12) (118)
- 241 (18 x 18) (2)
- 25 (1 x 25) (16)
- 26 (1 x 26) (12)
- 26 (2 x 13) (21)
- 27 (1 x 27) (12)
- 28 (1 x 28) (12)
- 28 (2 x 14) (111)
- 29 (1 x 29) (11)
- 3 (1 x 3) (18)
- 30 (1 x 30) (12)
- 30 (2 x 15) (40)
- 31 (1 x 31) (12)
- 32 (1 x 32) (13)
- 32 (2 x 16) (91)
- 321 (19 x 19) (2)
- 33 (1 x 33) (12)
- 34 (1 x 34) (12)
- 34 (2 x 17) (22)
- 35 (1 x 35) (12)
- 36 (1 x 36) (12)
- 36 (2 x 18) (38)
- 37 (1 x 37) (12)
- 37 (10 x 10) (1)
- 38 (1 x 38) (12)
- 38 (2 x 19) (22)
- 39 (1 x 39) (12)
- 4 (1 x 4) (18)
- 4 (2 x 2) (13)
- 40 (1 x 40) (13)
- 40 (2 x 20) (96)
- 42 (2 x 21) (10)
- 44 (2 x 22) (8)
- 48 (2 x 24) (45)
- 5 (1 x 5) (18)
- 50 (2 x 25) (18)
- 52 (2 x 26) (3)
- 56 (2 x 28) (1)
- 56 (9 x 9) (1)
- 58 (2 x 29) (1)
- 6 (1 x 6) (18)
- 6 (2 x 3) (48)
- 60 (2 x 30) (9)
- 64 (2 x 32) (18)
- 68 (10 x 10) (1)
- 68 (11 x 11) (2)
- 69 (11 x 11) (2)
- 7 (1 x 7) (19)
- 72 (11 x 11) (1)
- 8 (1 x 8) (19)
- 8 (2 x 4) (70)
- 84 (10 x 10) (1)
- 84 (13 x 13) (1)
- 9 (1 x 9) (19)
- Contact Material - Mating :
- Contact Finish Thickness - Post :
- Contact Material - Post :
- Applied Filters :
1987 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
3,252
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
633
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
1,416
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
1,478
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PG | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,127
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
3,685
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
3,768
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
3,805
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
2,104
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | - | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,190
In-stock
|
Preci-Dip | PGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | PGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 225 (18 x 18) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,170
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET PGA 241POS GOLD | PKA | Active | Bulk | - | Through Hole | Press-Fit | Open Frame | PGA | Thermoplastic, Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 241 (18 x 18) | Copper Alloy | 118.1µin (3.00µm) | Phosphor Bronze | |||
|
|
VIEW |
1,705
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,669
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGG | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,456
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 50POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 50 (2 x 25) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
|
VIEW |
1,908
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 50POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 50 (2 x 25) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
|
VIEW |
3,492
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Spacer | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 28 (2 x 14) | Brass | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,599
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,357
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,973
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,040
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,135
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,443
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | - | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,738
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Spacer | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 48 (2 x 24) | Brass | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,359
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Spacer | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 32 (2 x 16) | Brass | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,888
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,827
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PG | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,886
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
952
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,436
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | - | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,937
In-stock
|
Aries Electronics | CONN SOCKET PGA GOLD | PGM | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | - | PGA | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | - | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
