Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
GLOBAL STOCKS
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1,332
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Aries Electronics CONN IC DIP SOCKET ZIF 36POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 36 (2 x 18) Beryllium Nickel
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3,035
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Aries Electronics CONN IC DIP SOCKET ZIF 36POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 36 (2 x 18) Beryllium Nickel
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1,014
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Aries Electronics CONN IC DIP SOCKET ZIF 36POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 36 (2 x 18) Beryllium Nickel
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1,246
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Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Nickel
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1,442
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Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Nickel
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RFQ
2,683
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Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Nickel
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786
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Aries Electronics CONN IC DIP SOCKET ZIF 24POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 24 (2 x 12) Beryllium Nickel
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2,963
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Aries Electronics CONN IC DIP SOCKET ZIF 28POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 28 (2 x 14) Beryllium Nickel
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RFQ
3,030
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 28POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 28 (2 x 14) Beryllium Nickel
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RFQ
2,819
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 28POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 28 (2 x 14) Beryllium Nickel
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1,647
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Aries Electronics CONN IC DIP SOCKET ZIF 24POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 24 (2 x 12) Beryllium Nickel
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RFQ
1,081
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 24POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 24 (2 x 12) Beryllium Nickel
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RFQ
1,512
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 24POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 24 (2 x 12) Beryllium Nickel
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1,493
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Aries Electronics CONN IC DIP SOCKET ZIF 24POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 24 (2 x 12) Beryllium Nickel
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RFQ
1,875
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Aries Electronics CONN IC DIP SOCKET ZIF 48POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 48 (2 x 24) Beryllium Nickel
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3,454
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Aries Electronics CONN IC DIP SOCKET ZIF 48POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 48 (2 x 24) Beryllium Nickel
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RFQ
725
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Aries Electronics CONN IC DIP SOCKET ZIF 48POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 48 (2 x 24) Beryllium Nickel
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RFQ
3,728
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 48 (2 x 24) Beryllium Nickel
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RFQ
3,775
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Aries Electronics CONN IC DIP SOCKET ZIF 44POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 44 (2 x 22) Beryllium Nickel
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RFQ
3,241
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 42POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 42 (2 x 21) Beryllium Nickel
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RFQ
2,170
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 40POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 40 (2 x 20) Beryllium Nickel
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RFQ
2,410
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Aries Electronics CONN IC DIP SOCKET ZIF 44POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 44 (2 x 22) Beryllium Nickel
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RFQ
791
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 44POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 44 (2 x 22) Beryllium Nickel
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RFQ
2,116
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 44POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 44 (2 x 22) Beryllium Nickel
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RFQ
1,826
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 42POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 42 (2 x 21) Beryllium Nickel
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RFQ
3,508
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 42POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 42 (2 x 21) Beryllium Nickel
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VIEW
RFQ
957
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 42POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 42 (2 x 21) Beryllium Nickel
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RFQ
1,997
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Aries Electronics CONN IC DIP SOCKET ZIF 40POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 40 (2 x 20) Beryllium Nickel
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RFQ
1,279
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 40POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 40 (2 x 20) Beryllium Nickel
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RFQ
944
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 40POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 40 (2 x 20) Beryllium Nickel