Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
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1,851
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Aries Electronics CONN IC DIP SOCKET ZIF 24POS 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 24 (2 x 12) Beryllium Nickel
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1,084
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Aries Electronics CONN IC DIP SOCKET ZIF 24POS 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 24 (2 x 12) Beryllium Nickel
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3,005
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Aries Electronics CONN IC DIP SOCKET ZIF 24POS 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 24 (2 x 12) Beryllium Nickel
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1,775
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 24POS 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 24 (2 x 12) Beryllium Nickel
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1,437
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 24POS 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 24 (2 x 12) Beryllium Nickel
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RFQ
3,754
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 24POS 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 24 (2 x 12) Beryllium Nickel
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RFQ
3,405
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 24POS 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 24 (2 x 12) Beryllium Nickel
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611
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 24POS 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 24 (2 x 12) Beryllium Nickel
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RFQ
643
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 24POS 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 24 (2 x 12) Beryllium Nickel