Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post
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3,492
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Aries Electronics CONN IC DIP SOCKET 28POS GOLD - Active Bulk Through Hole Solder Spacer DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 28 (2 x 14) Brass 200.0µin (5.08µm)
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1,850
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Aries Electronics CONN IC DIP SOCKET 28POS GOLD - Active Bulk Through Hole Solder Spacer DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 28 (2 x 14) Brass 200.0µin (5.08µm)
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2,335
In-stock
Aries Electronics CONN IC DIP SOCKET 28POS GOLD - Active Bulk Through Hole Solder Spacer DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 28 (2 x 14) Brass 200.0µin (5.08µm)