Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
GLOBAL STOCKS
200-6313-9UN-1900
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VIEW
RFQ
2,422
In-stock
3M CONN SOCKET PGA ZIF 169POS GOLD Textool™ Active Bulk -55°C ~ 150°C Through Hole Solder - PGA, ZIF (ZIP) Polyethersulfone (PES) 0.100" (2.54mm) Gold 30.0µin (0.76µm) 169 (13 x 13) Beryllium Copper
224-5809-00-0602
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VIEW
RFQ
1,283
In-stock
3M CONN SOCKET SIP ZIF 24POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder - SIP, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold - 24 (1 x 24) Beryllium Copper
200-6321-9UN-1900
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VIEW
RFQ
1,027
In-stock
3M CONN SOCKET PGA ZIF 441POS GOLD Textool™ Active Bulk -55°C ~ 150°C Through Hole Solder - PGA, ZIF (ZIP) Polyethersulfone (PES) 0.100" (2.54mm) Gold 30.0µin (0.76µm) 441 (21 x 21) Beryllium Copper
200-6319-9UN-1900
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VIEW
RFQ
3,760
In-stock
3M CONN SOCKET PGA ZIF 361POS GOLD Textool™ Active Bulk -55°C ~ 150°C Through Hole Solder - PGA, ZIF (ZIP) Polyethersulfone (PES) 0.100" (2.54mm) Gold 30.0µin (0.76µm) 361 (19 x 19) Beryllium Copper
224-5205-01
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VIEW
RFQ
2,324
In-stock
3M CONN SOCKET QFN 24POS GOLD Textool™ Active Bulk - Through Hole Solder - QFN Polyethersulfone (PES) 0.020" (0.50mm) Gold - 24 (4 x 6) Beryllium Copper
232-2601-00-0602
RFQ
VIEW
RFQ
792
In-stock
3M CONN SOCKET SIP ZIF 32POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder - SIP, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold - 32 (1 x 32) Beryllium Copper
200-6310-9UN-1900
RFQ
VIEW
RFQ
1,447
In-stock
3M CONN SOCKET PGA ZIF 100POS GOLD Textool™ Active Bulk -55°C ~ 150°C Through Hole Solder - PGA, ZIF (ZIP) Polyethersulfone (PES) 0.100" (2.54mm) Gold 30.0µin (0.76µm) 100 (10 x 10) Beryllium Copper
228-5204-01
RFQ
VIEW
RFQ
1,842
In-stock
3M CONN SOCKET QFN 28POS GOLD Textool™ Active Bulk - Through Hole Solder - QFN Polyethersulfone (PES) 0.020" (0.50mm) Gold - 28 (4 x 7) Beryllium Copper
216-5205-01
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VIEW
RFQ
2,525
In-stock
3M CONN SOCKET QFN 16POS GOLD Textool™ Active Bulk - Through Hole Solder - QFN Polyethersulfone (PES) 0.020" (0.50mm) Gold - 16 (4 x 4) Beryllium Copper
200-6317-9UN-1900
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VIEW
RFQ
3,807
In-stock
3M CONN SOCKET PGA ZIF 289POS GOLD Textool™ Active Bulk -55°C ~ 150°C Through Hole Solder - PGA, ZIF (ZIP) Polyethersulfone (PES) 0.100" (2.54mm) Gold 30.0µin (0.76µm) 289 (17 x 17) Beryllium Copper
236-6225-00-0602
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VIEW
RFQ
3,826
In-stock
3M CONN SOCKET SIP ZIF 36POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder - SIP, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold - 36 (1 x 36) Beryllium Copper
200-6325-9UN-1900
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VIEW
RFQ
2,894
In-stock
3M CONN SOCKET PGA ZIF 625POS GOLD Textool™ Active Bulk -55°C ~ 150°C Through Hole Solder - PGA, ZIF (ZIP) Polyethersulfone (PES) 0.100" (2.54mm) Gold 30.0µin (0.76µm) 625 (25 x 25) Beryllium Copper
200-6311-9UN-1900
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VIEW
RFQ
3,967
In-stock
3M CONN SOCKET PGA ZIF 121POS GOLD Textool™ Active Bulk -55°C ~ 150°C Through Hole Solder - PGA, ZIF (ZIP) Polyethersulfone (PES) 0.100" (2.54mm) Gold 30.0µin (0.76µm) 121 (11 x 11) Beryllium Copper
220-2600-00-0602
RFQ
VIEW
RFQ
3,468
In-stock
3M CONN SOCKET SIP ZIF 20POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder - SIP, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold - 20 (1 x 20) Beryllium Copper
210-2599-00-0602
RFQ
VIEW
RFQ
3,164
In-stock
3M CONN SOCKET SIP ZIF 10POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder - SIP, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 10 (1 x 10) Beryllium Copper