Contact Finish - Mating :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Finish Thickness - Post Contact Material - Post
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2,829
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TE Connectivity AMP Connectors CONN SOCKET PQFP 132POS TIN-LEAD - Active Tube - Through Hole Solder Closed Frame QFP Liquid Crystal Polymer (LCP) 0.025" (0.64mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 132 (4 x 33) Phosphor Bronze 0.025" (0.64mm) 200.0µin (5.08µm) Phosphor Bronze
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2,031
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS TIN 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Tin - - 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) - Copper
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3,973
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 64 (2 x 32) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass Alloy
2-822114-4
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871
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TE Connectivity AMP Connectors CONN SOCKET PQFP 160POS TIN-LEAD - Active Tube - Through Hole Solder Closed Frame QFP Liquid Crystal Polymer (LCP) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 160 (4 x 40) Phosphor Bronze 0.050" (1.27mm) 200.0µin (5.08µm) Phosphor Bronze
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2,536
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS TINLEAD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 64 (2 x 32) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy
210-13-624-41-001000
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816
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass Alloy
210-13-324-41-001000
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2,539
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass Alloy
210-13-640-41-001000
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2,192
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass Alloy
210-13-314-41-001000
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1,814
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 14POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass Alloy
210-99-640-41-001000
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1,359
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS TINLEAD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy
210-99-628-41-001000
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762
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS TINLEAD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy
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1,397
In-stock
TE Connectivity AMP Connectors CONN SOCKET PQFP 132POS TIN-LEAD - Active Tube - Through Hole Solder Closed Frame QFP Liquid Crystal Polymer (LCP) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 132 (4 x 33) Phosphor Bronze 0.050" (1.27mm) 200.0µin (5.08µm) Phosphor Bronze
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2,839
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 8POS TIN-LEAD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy
522-AG10D
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1,227
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold - Gold 22 (2 x 11) Copper Alloy 0.100" (2.54mm) - Copper Alloy
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1,588
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TE Connectivity AMP Connectors CONN SOCKET SIP 20POS GOLD Diplomate DL Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 20 (1 x 20) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
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737
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) 25.0µin (0.63µm) Nickel
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2,771
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 64 (2 x 32) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy
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760
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) 25.0µin (0.63µm) Beryllium Copper
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1,451
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS TIN 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - Tin 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) - Beryllium Copper
6-1437536-3
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1,462
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold - - 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) - Brass
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1,673
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TIN 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - Tin 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) - Nickel
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3,135
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS TIN 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - Tin 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) - Nickel
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3,628
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass Alloy
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607
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS GOLD 217 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.75" (19.05mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin-Lead 64 (2 x 32) Beryllium Copper 0.070" (1.78mm) 200.0µin (5.08µm) Brass Alloy
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3,638
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) - Brass
210-99-314-41-001000
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1,133
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 14POS TINLEAD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy
2-1571550-8
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2,783
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) 25.0µin (0.63µm) Beryllium Copper
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2,008
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TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD 510 Active Tube - Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) Tin-Lead 10 (1 x 10) Beryllium Copper 0.100" (2.54mm) 20.0µin (0.51µm) Copper
643654-1
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2,339
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TE Connectivity AMP Connectors CONN SOCKET SIP 22POS TIN Diplomate DL Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 22 (1 x 22) Beryllium Copper 0.100" (2.54mm) - Beryllium Copper
210-99-632-41-001000
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2,322
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS TINLEAD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy