- Operating Temperature :
- Pitch - Mating :
- Contact Finish - Mating :
- Contact Finish Thickness - Mating :
- Number of Positions or Pins (Grid) :
-
- 10 (2 x 5) (2)
- 12 (1 x 12) (1)
- 132 (4 x 33) (3)
- 14 (1 x 14) (1)
- 14 (2 x 7) (6)
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- 20 (2 x 10) (5)
- 20 (4 x 5) (4)
- 21 (1 x 21) (1)
- 22 (2 x 11) (4)
- 24 (2 x 12) (2)
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- 32 (4 x 8) (4)
- 34 (2 x 17) (2)
- 36 (2 x 18) (2)
- 38 (2 x 19) (2)
- 40 (2 x 20) (3)
- 44 (2 x 22) (1)
- 44 (4 x 11) (3)
- 48 (2 x 24) (2)
- 52 (2 x 26) (1)
- 52 (4 x 13) (4)
- 68 (2 x 34) (1)
- 68 (4 x 17) (4)
- 8 (2 x 4) (6)
- 84 (2x42) (1)
- 84 (4 x 21) (4)
- Applied Filters :
95 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||
|
VIEW |
2,829
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET PQFP 132POS TIN-LEAD | - | Active | Tube | - | Through Hole | Solder | Closed Frame | QFP | Liquid Crystal Polymer (LCP) | 0.025" (0.64mm) | Tin-Lead | 200.0µin (5.08µm) | 132 (4 x 33) | Phosphor Bronze | 0.025" (0.64mm) | |||
|
VIEW |
871
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET PQFP 160POS TIN-LEAD | - | Active | Tube | - | Through Hole | Solder | Closed Frame | QFP | Liquid Crystal Polymer (LCP) | 0.050" (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | 160 (4 x 40) | Phosphor Bronze | 0.050" (1.27mm) | |||
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VIEW |
2,485
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 40 (2 x 20) | Phosphor Bronze | 0.100" (2.54mm) | |||
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|
VIEW |
1,834
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 34POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 34 (2 x 17) | Phosphor Bronze | 0.100" (2.54mm) | |||
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|
VIEW |
1,397
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET PQFP 132POS TIN-LEAD | - | Active | Tube | - | Through Hole | Solder | Closed Frame | QFP | Liquid Crystal Polymer (LCP) | 0.050" (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | 132 (4 x 33) | Phosphor Bronze | 0.050" (1.27mm) | |||
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|
VIEW |
1,931
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 32 (2 x 16) | Phosphor Bronze | 0.100" (2.54mm) | |||
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|
VIEW |
2,498
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Phosphor Bronze | 0.100" (2.54mm) | |||
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|
VIEW |
1,220
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 10 (2 x 5) | Phosphor Bronze | 0.100" (2.54mm) | |||
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|
VIEW |
2,460
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 32 (2 x 16) | Phosphor Bronze | 0.100" (2.54mm) | |||
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|
VIEW |
2,302
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 8 (2 x 4) | Phosphor Bronze | 0.100" (2.54mm) | |||
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|
VIEW |
1,448
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 8POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 8 (2 x 4) | Phosphor Bronze | 0.100" (2.54mm) | |||
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|
VIEW |
2,549
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 38POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 38 (2 x 19) | Phosphor Bronze | 0.100" (2.54mm) | |||
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|
VIEW |
2,020
In-stock
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Aries Electronics | CONN IC DIP SOCKET 30POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 30 (2 x 15) | Phosphor Bronze | 0.100" (2.54mm) | |||
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|
VIEW |
2,105
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 22POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 22 (2 x 11) | Phosphor Bronze | 0.100" (2.54mm) | |||
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|
VIEW |
1,451
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 28 (2 x 14) | Phosphor Bronze | 0.100" (2.54mm) | |||
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|
VIEW |
1,461
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 18POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 18 (2 x 9) | Phosphor Bronze | 0.100" (2.54mm) | |||
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|
VIEW |
784
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 30POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 30 (2 x 15) | Phosphor Bronze | 0.100" (2.54mm) | |||
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|
VIEW |
3,932
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET PQFP 132POS TIN-LEAD | - | Active | Tube | - | Through Hole | Solder | Closed Frame | QFP | Liquid Crystal Polymer (LCP) | 0.025" (0.64mm) | Tin-Lead | 200.0µin (5.08µm) | 132 (4 x 33) | Phosphor Bronze | 0.025" (0.64mm) | |||
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|
VIEW |
841
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 20 (2 x 10) | Phosphor Bronze | 0.100" (2.54mm) | |||
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|
VIEW |
1,985
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 12POS TIN | Diplomate DL | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | 12 (1 x 12) | Phosphor Bronze | 0.100" (2.54mm) | |||
|
VIEW |
3,700
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | 28 (2 x 14) | Phosphor Bronze | 0.100" (2.54mm) | |||
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|
VIEW |
3,899
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 36 (2 x 18) | Phosphor Bronze | 0.100" (2.54mm) | |||
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|
VIEW |
3,156
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 14 (2 x 7) | Phosphor Bronze | 0.100" (2.54mm) | |||
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|
VIEW |
765
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 22POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 22 (2 x 11) | Phosphor Bronze | 0.100" (2.54mm) | |||
|
VIEW |
1,974
In-stock
|
On Shore Technology Inc. | CONN SOCKET PLCC 32POS TIN | ED | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | PLCC | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Tin | - | 32 (2 x 16) | Phosphor Bronze | 0.100" (2.54mm) | |||
|
VIEW |
1,662
In-stock
|
On Shore Technology Inc. | CONN SOCKET PLCC 28POS TIN | ED | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | PLCC | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Tin | - | 28 (2 x 14) | Phosphor Bronze | 0.100" (2.54mm) | |||
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|
VIEW |
1,608
In-stock
|
CNC Tech | CONN SOCKET PLCC 20POS GOLD | - | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | PLCC | Polybutylene Terephthalate (PBT), Glass Filled | 0.050" (1.27mm) | Gold | - | 20 (4 x 5) | Phosphor Bronze | 0.050" (1.27mm) | |||
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|
VIEW |
2,408
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 16 (2 x 8) | Phosphor Bronze | 0.100" (2.54mm) | |||
|
|
VIEW |
1,821
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 36POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 36 (2 x 18) | Phosphor Bronze | 0.100" (2.54mm) | |||
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|
VIEW |
2,595
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 18 (2 x 9) | Phosphor Bronze | 0.100" (2.54mm) | |||
