Sockets for ICs, Transistors Products For Sale - PDF - Connectors, Interconnects -

Applied Filters :

17 results

Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish Thickness - Post	Contact Material - Post
GLOBAL STOCKS
	30-3513-11H	RFQ VIEW	PDF RFQ	3,627 In-stock	Aries Electronics	CONN IC DIP SOCKET 30POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	30 (2 x 15)	Beryllium Copper	10.0µin (0.25µm)	Brass
	30-6513-11H	RFQ VIEW	PDF RFQ	3,742 In-stock	Aries Electronics	CONN IC DIP SOCKET 30POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	30 (2 x 15)	Beryllium Copper	10.0µin (0.25µm)	Brass
	30-9513-11	RFQ VIEW	PDF RFQ	2,392 In-stock	Aries Electronics	CONN IC DIP SOCKET 30POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.9" (22.86mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	30 (2 x 15)	Beryllium Copper	10.0µin (0.25µm)	Brass
	30-3513-10	RFQ VIEW	PDF RFQ	3,345 In-stock	Aries Electronics	CONN IC DIP SOCKET 30POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	30 (2 x 15)	Beryllium Copper	200.0µin (5.08µm)	Brass
	30-6513-10	RFQ VIEW	PDF RFQ	1,284 In-stock	Aries Electronics	CONN IC DIP SOCKET 30POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	30 (2 x 15)	Beryllium Copper	200.0µin (5.08µm)	Brass
	30-6511-10	RFQ VIEW	PDF RFQ	2,020 In-stock	Aries Electronics	CONN IC DIP SOCKET 30POS TIN		511	Active	Bulk	-55°C ~ 105°C	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Tin	30 (2 x 15)	Phosphor Bronze	200.0µin (5.08µm)	Phosphor Bronze
	30-6511-11	RFQ VIEW	PDF RFQ	784 In-stock	Aries Electronics	CONN IC DIP SOCKET 30POS GOLD		511	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	30 (2 x 15)	Phosphor Bronze	10.0µin (0.25µm)	Phosphor Bronze
	30-9513-10H	RFQ VIEW	PDF RFQ	3,250 In-stock	Aries Electronics	CONN IC DIP SOCKET 30POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.9" (22.86mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	30 (2 x 15)	Beryllium Copper	200.0µin (5.08µm)	Brass
	30-9513-10T	RFQ VIEW	PDF RFQ	1,579 In-stock	Aries Electronics	CONN IC DIP SOCKET 30POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.9" (22.86mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	30 (2 x 15)	Beryllium Copper	200.0µin (5.08µm)	Brass
	30-9513-10	RFQ VIEW	PDF RFQ	1,044 In-stock	Aries Electronics	CONN IC DIP SOCKET 30POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.9" (22.86mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	30 (2 x 15)	Beryllium Copper	200.0µin (5.08µm)	Brass
	30-9513-11H	RFQ VIEW	PDF RFQ	2,295 In-stock	Aries Electronics	CONN IC DIP SOCKET 30POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.9" (22.86mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	30 (2 x 15)	Beryllium Copper	10.0µin (0.25µm)	Brass
	30-3513-10H	RFQ VIEW	PDF RFQ	617 In-stock	Aries Electronics	CONN IC DIP SOCKET 30POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	30 (2 x 15)	Beryllium Copper	200.0µin (5.08µm)	Brass
	30-6513-10H	RFQ VIEW	PDF RFQ	3,116 In-stock	Aries Electronics	CONN IC DIP SOCKET 30POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	30 (2 x 15)	Beryllium Copper	200.0µin (5.08µm)	Brass
	30-3513-11	RFQ VIEW	PDF RFQ	1,125 In-stock	Aries Electronics	CONN IC DIP SOCKET 30POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	30 (2 x 15)	Beryllium Copper	10.0µin (0.25µm)	Brass
	30-6513-11	RFQ VIEW	PDF RFQ	1,799 In-stock	Aries Electronics	CONN IC DIP SOCKET 30POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Gold	30 (2 x 15)	Beryllium Copper	10.0µin (0.25µm)	Brass
	30-3513-10T	RFQ VIEW	PDF RFQ	1,787 In-stock	Aries Electronics	CONN IC DIP SOCKET 30POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	30 (2 x 15)	Beryllium Copper	200.0µin (5.08µm)	Brass
	30-6513-10T	RFQ VIEW	PDF RFQ	1,894 In-stock	Aries Electronics	CONN IC DIP SOCKET 30POS GOLD		Lo-PRO®file, 513	Active	Bulk	-	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Tin	30 (2 x 15)	Beryllium Copper	200.0µin (5.08µm)	Brass

1 / 1

＜Prev Next＞