Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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1,588
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TE Connectivity AMP Connectors CONN SOCKET SIP 20POS GOLD Diplomate DL Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 20 (1 x 20) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
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1,471
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TE Connectivity AMP Connectors CONN SOCKET SIP 20POS GOLD 500 Active Bulk - Through Hole Solder Closed Frame SIP - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (1 x 20) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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1,176
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TE Connectivity AMP Connectors CONN SOCKET SIP 20POS GOLD - Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (1 x 20) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
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3,026
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (1 x 20) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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1,586
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 20 (1 x 20) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
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3,483
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TE Connectivity AMP Connectors CONN SOCKET SIP 20POS GOLD 500 Active Bulk - Through Hole Solder Closed Frame SIP - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (1 x 20) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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3,850
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (1 x 20) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
2-1571994-0
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3,988
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TE Connectivity AMP Connectors CONN SOCKET SIP 20POS GOLD 510 Active Bulk - Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) Tin 20 (1 x 20) Beryllium Copper 20.0µin (0.51µm) Copper
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1,591
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Assmann WSW Components SOCKET 20 CONTACTS SINGLE ROW - Active - -40°C ~ 105°C Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold Flash Tin 20 (1 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
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3,477
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TE Connectivity AMP Connectors CONN SOCKET SIP 20POS GOLD - Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold Flash Tin 20 (1 x 20) Beryllium Copper 196.9µin (5.00µm) Brass
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2,495
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TE Connectivity AMP Connectors CONN SOCKET SIP 20POS TINLEAD - Active Bulk - Through Hole Solder Closed Frame SIP Thermoplastic 0.100" (2.54mm) Tin-Lead - Tin-Lead 20 (1 x 20) Beryllium Copper - Brass
MS06
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1,262
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Apex Microtechnology CONN SOCKET SIP 20POS GOLD Apex Precision Power® Active Bulk - Through Hole Solder Closed Frame SIP Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 20 (1 x 20) Beryllium Copper 200.0µin (5.08µm) Brass