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24 results
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
Default Photo
10-6511-11
RFQ
VIEW
RFQ
1,220
In-stock
 Aries Electronics CONN IC DIP SOCKET 10POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10 (2 x 5) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
10-9513-10H
10-9513-10H
RFQ
VIEW
RFQ
2,455
In-stock
 Aries Electronics CONN IC DIP SOCKET 10POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass
10-3513-10H
10-3513-10H
RFQ
VIEW
RFQ
3,580
In-stock
 Aries Electronics CONN IC DIP SOCKET 10POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass
10-2513-10H
10-2513-10H
RFQ
VIEW
RFQ
3,953
In-stock
 Aries Electronics CONN IC DIP SOCKET 10POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass
10-9513-10T
10-9513-10T
RFQ
VIEW
RFQ
3,343
In-stock
 Aries Electronics CONN IC DIP SOCKET 10POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
1814643-8
RFQ
VIEW
RFQ
1,049
In-stock
 TE Connectivity AMP Connectors CONN IC DIP SOCKET 10POS GOLD - Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) - 10 (2 x 5) Beryllium Copper - Brass
10-6513-10T
10-6513-10T
RFQ
VIEW
RFQ
3,061
In-stock
 Aries Electronics CONN IC DIP SOCKET 10POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass
Default Photo
10-2511-11
RFQ
VIEW
RFQ
2,790
In-stock
 Aries Electronics CONN IC DIP SOCKET 10POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10 (2 x 5) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
10-6513-10H
10-6513-10H
RFQ
VIEW
RFQ
3,026
In-stock
 Aries Electronics CONN IC DIP SOCKET 10POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass
10-3513-11H
10-3513-11H
RFQ
VIEW
RFQ
2,809
In-stock
 Aries Electronics CONN IC DIP SOCKET 10POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10 (2 x 5) Beryllium Copper 10.0µin (0.25µm) Brass
10-9513-10
10-9513-10
RFQ
VIEW
RFQ
2,655
In-stock
 Aries Electronics CONN IC DIP SOCKET 10POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass
10-2513-11H
10-2513-11H
RFQ
VIEW
RFQ
956
In-stock
 Aries Electronics CONN IC DIP SOCKET 10POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10 (2 x 5) Beryllium Copper 10.0µin (0.25µm) Brass
10-4513-11H
10-4513-11H
RFQ
VIEW
RFQ
2,117
In-stock
 Aries Electronics CONN IC DIP SOCKET 10POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10 (2 x 5) Beryllium Copper 10.0µin (0.25µm) Brass
10-6513-10
10-6513-10
RFQ
VIEW
RFQ
2,839
In-stock
 Aries Electronics CONN IC DIP SOCKET 10POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass
10-2513-10
10-2513-10
RFQ
VIEW
RFQ
1,737
In-stock
 Aries Electronics CONN IC DIP SOCKET 10POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass
10-9513-11H
10-9513-11H
RFQ
VIEW
RFQ
783
In-stock
 Aries Electronics CONN IC DIP SOCKET 10POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10 (2 x 5) Beryllium Copper 10.0µin (0.25µm) Brass
10-9513-11
10-9513-11
RFQ
VIEW
RFQ
2,264
In-stock
 Aries Electronics CONN IC DIP SOCKET 10POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10 (2 x 5) Beryllium Copper 10.0µin (0.25µm) Brass
10-6513-11H
10-6513-11H
RFQ
VIEW
RFQ
3,577
In-stock
 Aries Electronics CONN IC DIP SOCKET 10POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10 (2 x 5) Beryllium Copper 10.0µin (0.25µm) Brass
10-6513-11
10-6513-11
RFQ
VIEW
RFQ
778
In-stock
 Aries Electronics CONN IC DIP SOCKET 10POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10 (2 x 5) Beryllium Copper 10.0µin (0.25µm) Brass
10-3513-11
10-3513-11
RFQ
VIEW
RFQ
3,326
In-stock
 Aries Electronics CONN IC DIP SOCKET 10POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10 (2 x 5) Beryllium Copper 10.0µin (0.25µm) Brass
10-2513-11
10-2513-11
RFQ
VIEW
RFQ
2,904
In-stock
 Aries Electronics CONN IC DIP SOCKET 10POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10 (2 x 5) Beryllium Copper 10.0µin (0.25µm) Brass
10-3513-10T
10-3513-10T
RFQ
VIEW
RFQ
3,430
In-stock
 Aries Electronics CONN IC DIP SOCKET 10POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass
10-2513-10T
10-2513-10T
RFQ
VIEW
RFQ
1,140
In-stock
 Aries Electronics CONN IC DIP SOCKET 10POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass
10-3513-10
10-3513-10
RFQ
VIEW
RFQ
2,433
In-stock
 Aries Electronics CONN IC DIP SOCKET 10POS GOLD Lo-PRO®file, 513 Active Bulk - Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass
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