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23 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
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VIEW |
2,327
In-stock
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 6 (2 x 3) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
790
In-stock
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 6 (2 x 3) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
2,151
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 6POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Gold | 6 (2 x 3) | Beryllium Copper | 25.0µin (0.63µm) | Brass | |||
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VIEW |
2,006
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 6POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | Flash | Gold | 6 (2 x 3) | Beryllium Copper | Flash | Nickel | |||
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VIEW |
3,626
In-stock
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 6 (2 x 3) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
1,439
In-stock
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 6 (2 x 3) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
1,438
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 6POS TIN | 500 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | - | Tin | 6 (2 x 3) | Beryllium Copper | - | Beryllium Copper | |||
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VIEW |
2,367
In-stock
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 6 (2 x 3) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
2,032
In-stock
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 6 (2 x 3) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
761
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 6POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Gold | 6 (2 x 3) | Beryllium Copper | 25.0µin (0.63µm) | Beryllium Copper | |||
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VIEW |
1,515
In-stock
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 6 (2 x 3) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
3,472
In-stock
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 6 (2 x 3) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,226
In-stock
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 6 (2 x 3) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,609
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 6POS GOLD | 500 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Tin-Lead | 6 (2 x 3) | Copper Alloy | - | Copper Alloy | |||
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VIEW |
3,549
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 6POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | - | Gold | 6 (2 x 3) | Copper Alloy | - | Copper Alloy | |||
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VIEW |
2,037
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 6POS GOLD | 500 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Tin-Lead | 6 (2 x 3) | Copper Alloy | - | Copper Alloy | |||
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VIEW |
3,961
In-stock
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 6 (2 x 3) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
679
In-stock
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 6 (2 x 3) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,551
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 6 (2 x 3) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
1,577
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 6POS GOLD | 500 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 6 (2 x 3) | Beryllium Copper | 47.2µin (1.20µm) | Copper Alloy | |||
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|
VIEW |
2,583
In-stock
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 6 (2 x 3) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
2,025
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 6 (2 x 3) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
902
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 6 (2 x 3) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
