- Operating Temperature :
- Housing Material :
- Contact Finish Thickness - Mating :
- Contact Material - Mating :
- Contact Material - Post :
- Applied Filters :
46 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
2,498
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 16 (2 x 8) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
|
VIEW |
2,574
In-stock
|
Mill-Max Manufacturing Corp. | CONN ZIG-ZAG 16POS GOLD | 410 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, Left Stackable | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
2,643
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,280
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,422
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 16POS TINLEAD | 210 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Tin-Lead | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
1,212
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 16POS TINLEAD | 500 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Tin-Lead | - | Tin-Lead | 16 (2 x 8) | Beryllium Copper | - | Beryllium Copper | |||
|
|
VIEW |
2,408
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 16 (2 x 8) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
|
VIEW |
1,334
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
3,961
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,865
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 16POS GOLD | 210 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
1,365
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,754
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,435
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 16POS TINLEAD | 500 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Tin-Lead | - | Tin-Lead | 16 (2 x 8) | Beryllium Copper | - | Beryllium Copper | |||
|
|
VIEW |
2,582
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,713
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,291
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,615
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,509
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
643
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,825
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 16POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Gold | - | Gold | 16 (2 x 8) | Copper Alloy | - | Copper Alloy | |||
|
|
VIEW |
1,068
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 16POS GOLD | 210 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
|
VIEW |
3,214
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 16POS GOLD | Diplomate DL | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 16 (2 x 8) | Phosphor Bronze | 30.0µin (0.76µm) | Phosphor Bronze | |||
|
VIEW |
3,855
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 16POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Gold | - | - | 16 (2 x 8) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
2,846
In-stock
|
Omron Electronics Inc-EMC Div | CONN ZIG-ZAG 16POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
3,297
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 16POS GOLD | 500 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 5.00µin (0.127µm) | Tin-Lead | 16 (2 x 8) | Beryllium Copper | 5.00µin (0.127µm) | Beryllium Copper | |||
|
|
VIEW |
1,689
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 16 (2 x 8) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
3,630
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 16POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | Flash | Gold | 16 (2 x 8) | Beryllium Copper | Flash | Nickel | |||
|
|
VIEW |
2,581
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 16POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 16 (2 x 8) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
VIEW |
1,809
In-stock
|
3M | CONN SOCKET SOIC 16POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | Gold | 16 (2 x 8) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
VIEW |
2,685
In-stock
|
3M | CONN SOCKET SOIC 16POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | Gold | 16 (2 x 8) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
