- Packaging :
- Operating Temperature :
- Type :
-
- BGA (46)
- DIP, 0.2" (5.08mm) Row Spacing (18)
- DIP, 0.3" (7.62mm) Row Spacing (111)
- DIP, 0.4" (10.16mm) Row Spacing (14)
- DIP, 0.6" (15.24mm) Row Spacing (123)
- DIP, 0.9" (22.86mm) Row Spacing (42)
- DIP, ZIF (ZIP) (13)
- DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing (48)
- DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing (31)
- PGA (23)
- SIP (14)
- Zig-Zag (1)
- Pitch - Mating :
- Contact Finish - Post :
- Number of Positions or Pins (Grid) :
-
- 10 (1 x 10) (1)
- 10 (2 x 5) (23)
- 11 (1 x 11) (1)
- 12 (2 x 6) (11)
- 14 (1 x 14) (1)
- 14 (2 x 7) (18)
- 15 (1 x 15) (2)
- 16 (1 x 16) (2)
- 16 (2 x 8) (20)
- 18 (2 x 9) (13)
- 192 (16 x 16) (3)
- 2 (1 x 2) (4)
- 20 (1 x 20) (4)
- 20 (2 x 10) (17)
- 22 (2 x 11) (13)
- 24 (2 x 12) (32)
- 255 (16 x 16) (3)
- 256 (16 x 16) (3)
- 256 (20 x 20) (3)
- 26 (2 x 13) (6)
- 272 (20 x 20) (3)
- 28 (2 x 14) (35)
- 292 (20 x 20) (3)
- 3 (1 x 3) (1)
- 30 (2 x 15) (16)
- 32 (2 x 16) (29)
- 34 (2 x 17) (6)
- 352 (26 x 26) (3)
- 356 (26 x 26) (3)
- 357 (19 x 19) (3)
- 36 (2 x 18) (16)
- 360 (19 x 19) (3)
- 38 (2 x 19) (6)
- 388 (26 x 26) (3)
- 4 (2 x 2) (2)
- 40 (2 x 20) (41)
- 400 (20 x 20) (3)
- 42 (2 x 21) (7)
- 420 (26 x 26) (3)
- 432 (31 x 31) (3)
- 44 (2 x 22) (6)
- 456 (26 x 26) (3)
- 48 (2 x 24) (26)
- 480 (29 x 29) (3)
- 50 (2 x 25) (5)
- 500 (30 x 30) (3)
- 504 (29 x 29) (3)
- 52 (2 x 26) (1)
- 520 (31 x 31) (3)
- 560 (33 x 33) (3)
- 576 (30 x 30) (3)
- 6 (2 x 3) (15)
- 60 (2 x 30) (5)
- 600 (35 x 35) (3)
- 64 (2 x 32) (5)
- 652 (35 x 35) (3)
- 7 (1 x 7) (1)
- 8 (2 x 4) (23)
- Contact Material - Mating :
- Applied Filters :
484 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
3,252
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
|
VIEW |
2,467
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 652 (35 x 35) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
3,438
In-stock
|
Preci-Dip | BGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 652 (35 x 35) | Brass | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
3,345
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 600 (35 x 35) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
604
In-stock
|
Preci-Dip | BGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 560 (33 x 33) | Brass | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
2,836
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 576 (30 x 30) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,541
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 520 (31 x 31) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,316
In-stock
|
Preci-Dip | BGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 600 (35 x 35) | Brass | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,295
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 560 (33 x 33) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,927
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 504 (29 x 29) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
2,073
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 500 (30 x 30) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
706
In-stock
|
Preci-Dip | BGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 576 (30 x 30) | Brass | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
3,322
In-stock
|
Preci-Dip | BGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 520 (31 x 31) | Brass | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
2,486
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 480 (29 x 29) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,714
In-stock
|
Preci-Dip | BGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 504 (29 x 29) | Brass | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,951
In-stock
|
Preci-Dip | BGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 500 (30 x 30) | Brass | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
2,079
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 456 (26 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
2,124
In-stock
|
Preci-Dip | BGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 480 (29 x 29) | Brass | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
633
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
|
VIEW |
1,416
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
|
VIEW |
1,231
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 432 (31 x 31) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
2,185
In-stock
|
Preci-Dip | BGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 456 (26 x 26) | Brass | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,125
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 652 (35 x 35) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
3,763
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 420 (26 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
765
In-stock
|
Preci-Dip | BGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 432 (31 x 31) | Brass | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,371
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 400 (20 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,703
In-stock
|
Preci-Dip | BGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 420 (26 x 26) | Brass | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,242
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 600 (35 x 35) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
849
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 388 (26 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,343
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 576 (30 x 30) | Beryllium Copper | 10.0µin (0.25µm) | Brass |