Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
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2,485
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Aries Electronics CONN IC DIP SOCKET 40POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 40 (2 x 20) Phosphor Bronze
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1,834
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Aries Electronics CONN IC DIP SOCKET 34POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 34 (2 x 17) Phosphor Bronze
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1,931
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Aries Electronics CONN IC DIP SOCKET 32POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Phosphor Bronze
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2,498
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Aries Electronics CONN IC DIP SOCKET 16POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 16 (2 x 8) Phosphor Bronze
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1,220
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Aries Electronics CONN IC DIP SOCKET 10POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 10 (2 x 5) Phosphor Bronze
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2,460
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Aries Electronics CONN IC DIP SOCKET 32POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Phosphor Bronze
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2,302
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Aries Electronics CONN IC DIP SOCKET 8POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 8 (2 x 4) Phosphor Bronze
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1,448
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Aries Electronics CONN IC DIP SOCKET 8POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 8 (2 x 4) Phosphor Bronze
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2,549
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Aries Electronics CONN IC DIP SOCKET 38POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 38 (2 x 19) Phosphor Bronze
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2,020
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Aries Electronics CONN IC DIP SOCKET 30POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 30 (2 x 15) Phosphor Bronze
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2,105
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Aries Electronics CONN IC DIP SOCKET 22POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 22 (2 x 11) Phosphor Bronze
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1,451
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Aries Electronics CONN IC DIP SOCKET 28POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 28 (2 x 14) Phosphor Bronze
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1,461
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Aries Electronics CONN IC DIP SOCKET 18POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 18 (2 x 9) Phosphor Bronze
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784
In-stock
Aries Electronics CONN IC DIP SOCKET 30POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 30 (2 x 15) Phosphor Bronze
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841
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Aries Electronics CONN IC DIP SOCKET 20POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 20 (2 x 10) Phosphor Bronze
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3,899
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Aries Electronics CONN IC DIP SOCKET 36POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 36 (2 x 18) Phosphor Bronze
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3,156
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 14 (2 x 7) Phosphor Bronze
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765
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Aries Electronics CONN IC DIP SOCKET 22POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 22 (2 x 11) Phosphor Bronze
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2,408
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Aries Electronics CONN IC DIP SOCKET 16POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 16 (2 x 8) Phosphor Bronze
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RFQ
1,821
In-stock
Aries Electronics CONN IC DIP SOCKET 36POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 36 (2 x 18) Phosphor Bronze
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2,595
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Aries Electronics CONN IC DIP SOCKET 18POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 18 (2 x 9) Phosphor Bronze
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2,291
In-stock
Aries Electronics CONN IC DIP SOCKET 20POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 20 (2 x 10) Phosphor Bronze
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RFQ
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RFQ
1,821
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Aries Electronics CONN IC DIP SOCKET 34POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 34 (2 x 17) Phosphor Bronze
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RFQ
2,790
In-stock
Aries Electronics CONN IC DIP SOCKET 10POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 10 (2 x 5) Phosphor Bronze
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RFQ
2,934
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Aries Electronics CONN IC DIP SOCKET 22POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 22 (2 x 11) Phosphor Bronze
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RFQ
1,967
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Aries Electronics CONN IC DIP SOCKET 38POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 38 (2 x 19) Phosphor Bronze
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RFQ
2,225
In-stock
Aries Electronics CONN IC DIP SOCKET 20POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 20 (2 x 10) Phosphor Bronze
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3,011
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 14 (2 x 7) Phosphor Bronze
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852
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 14 (2 x 7) Phosphor Bronze
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3,161
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Aries Electronics CONN IC DIP SOCKET 48POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 48 (2 x 24) Phosphor Bronze