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31 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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VIEW |
3,079
In-stock
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3M | CONN ZIG-ZAG ZIF 51POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 51 (1 x 25, 1 x 26) | Beryllium Copper | 0.050" (1.27mm) | |||
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VIEW |
1,594
In-stock
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3M | CONN ZIG-ZAG ZIF 51POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 51 (1 x 25, 1 x 26) | Beryllium Copper | 0.050" (1.27mm) | |||
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VIEW |
1,340
In-stock
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3M | CONN ZIG-ZAG ZIF 35POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 35 (1 x 17, 1 x 18) | Beryllium Copper | 0.050" (1.27mm) | |||
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VIEW |
1,425
In-stock
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3M | CONN ZIG-ZAG ZIF 35POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 35 (1 x 17, 1 x 18) | Beryllium Copper | 0.050" (1.27mm) | |||
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VIEW |
3,872
In-stock
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3M | CONN ZIG-ZAG ZIF 35POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 35 (1 x 17, 1 x 18) | Beryllium Copper | 0.050" (1.27mm) | |||
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VIEW |
1,541
In-stock
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3M | CONN ZIG-ZAG ZIF 35POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 35 (1 x 17, 1 x 18) | Beryllium Copper | 0.050" (1.27mm) | |||
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VIEW |
2,113
In-stock
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3M | CONN ZIG-ZAG ZIF 34POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 34 (2 x 17) | Beryllium Copper | 0.050" (1.27mm) | |||
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VIEW |
2,128
In-stock
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3M | CONN ZIG-ZAG ZIF 34POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 34 (1 x 34) | Beryllium Copper | 0.050" (1.27mm) | |||
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|
VIEW |
3,597
In-stock
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3M | CONN ZIG-ZAG ZIF 34POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 34 (2 x 17) | Beryllium Copper | 0.050" (1.27mm) | |||
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|
VIEW |
941
In-stock
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3M | CONN ZIG-ZAG ZIF 34POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 34 (2 x 17) | Beryllium Copper | 0.050" (1.27mm) | |||
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VIEW |
3,287
In-stock
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3M | CONN SOCKET SOIC 18POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | 18 (2 x 9) | Beryllium Copper | - | |||
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VIEW |
2,422
In-stock
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3M | CONN SOCKET PGA ZIF 32POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | |||
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VIEW |
1,947
In-stock
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3M | CONN SOCKET PGA ZIF 32POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | |||
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VIEW |
2,942
In-stock
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3M | CONN SOCKET QFN 48POS GOLD | Textool™ | Active | Bulk | - | Through Hole | Solder | Closed Frame | QFN | Polyethersulfone (PES) | 0.016" (0.40mm) | Gold | - | 48 (4 x 12) | Beryllium Copper | - | |||
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VIEW |
1,809
In-stock
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3M | CONN SOCKET SOIC 16POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | 16 (2 x 8) | Beryllium Copper | - | |||
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VIEW |
1,037
In-stock
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3M | CONN SOCKET QFN 32POS GOLD | Textool™ | Active | Bulk | - | Through Hole | Solder | Closed Frame | QFN | Polyethersulfone (PES) | - | Gold | - | 32 (4 x 8) | Beryllium Copper | - | |||
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VIEW |
1,560
In-stock
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3M | CONN SOCKET SOIC 28POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | 28 (2 x 14) | Beryllium Copper | - | |||
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VIEW |
2,685
In-stock
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3M | CONN SOCKET SOIC 16POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | 16 (2 x 8) | Beryllium Copper | - | |||
|
VIEW |
783
In-stock
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3M | CONN SOCKET SOIC 14POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | 14 (2 x 7) | Beryllium Copper | - | |||
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VIEW |
3,945
In-stock
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3M | CONN SOCKET QFN 48POS GOLD | Textool™ | Active | Bulk | - | Through Hole | Solder | Closed Frame | QFN | Polyethersulfone (PES) | 0.020" (0.50mm) | Gold | - | 48 (4 x 12) | Beryllium Copper | - | |||
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VIEW |
2,214
In-stock
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3M | CONN SOCKET QFN 40POS GOLD | Textool™ | Active | Bulk | - | Through Hole | Solder | Closed Frame | QFN | Polyethersulfone (PES) | - | Gold | - | 40 (4 x 10) | Beryllium Copper | - | |||
|
VIEW |
2,126
In-stock
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3M | CONN ZIG-ZAG ZIF 51POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 51 (1 x 25, 1 x 26) | Beryllium Copper | 0.050" (1.27mm) | |||
|
VIEW |
3,265
In-stock
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3M | CONN ZIG-ZAG ZIF 51POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 51 (1 x 25, 1 x 26) | Beryllium Copper | 0.050" (1.27mm) | |||
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VIEW |
1,901
In-stock
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3M | CONN SOCKET QFN 40POS GOLD | Textool™ | Active | Bulk | - | Through Hole | Solder | Closed Frame | QFN | Polyethersulfone (PES) | - | Gold | - | 40 (4 x 10) | Beryllium Copper | - | |||
|
VIEW |
1,305
In-stock
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3M | CONN SOCKET SOIC 24POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | 24 (2 x 12) | Beryllium Copper | - | |||
|
VIEW |
2,716
In-stock
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3M | CONN SOCKET SOIC 20POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | 20 (2 x 10) | Beryllium Copper | - | |||
|
VIEW |
2,597
In-stock
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3M | CONN IC DIP SOCKET ZIF 90POS GLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.070" (1.78mm) | Gold | 30.0µin (0.76µm) | 90 (2 x 45) | Beryllium Copper | 0.070" (1.78mm) | |||
|
VIEW |
3,100
In-stock
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3M | CONN SOCKET SOIC 28POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | 28 (2 x 14) | Beryllium Copper | - | |||
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VIEW |
1,922
In-stock
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3M | CONN SOCKET QFN 48POS GOLD | Textool™ | Active | Bulk | - | Through Hole | Solder | Closed Frame | QFN | Polyethersulfone (PES) | 0.020" (0.50mm) | Gold | - | 48 (4 x 12) | Beryllium Copper | - | |||
|
VIEW |
1,992
In-stock
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3M | CONN TRANSIST TO-3/TO-66 3POS | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | Transistor, TO-3 and TO-66 | Polyphenylene Sulfide (PPS), Glass Filled | - | Gold | 30.0µin (0.76µm) | 3 (Rectangular) | Beryllium Copper | 0.234" (5.94mm) | |||
