- Housing Material :
-
- Polyamide (PA46), Nylon 4/6, Glass Filled (49)
- Polybutylene Terephthalate (PBT) (7)
- Polybutylene Terephthalate (PBT), Glass Filled (6)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (17)
- Polyester (16)
- Polyether Imide (PEI), Glass Filled (2)
- Polyphenylene Sulfide (PPS), Glass Filled (1)
- Thermoplastic (1)
- Thermoplastic, Glass Filled (13)
- Thermoplastic, Polyester (2)
- Pitch - Mating :
- Contact Finish Thickness - Mating :
- Number of Positions or Pins (Grid) :
-
- 10 (1 x 10) (1)
- 12 (1 x 12) (1)
- 13 (1 x 13) (1)
- 14 (1 x 14) (2)
- 14 (2 x 7) (9)
- 15 (1 x 15) (1)
- 16 (2 x 8) (14)
- 17 (1 x 17) (1)
- 18 (2 x 9) (1)
- 20 (2 x 10) (8)
- 20 (4 x 5) (2)
- 21 (1 x 21) (1)
- 22 (1 x 22) (1)
- 22 (2 x 11) (3)
- 23 (1 x 23) (1)
- 24 (2 x 12) (10)
- 28 (2 x 14) (12)
- 28 (4 x 7) (1)
- 29 (1 x 29) (1)
- 30 (2 x 15) (1)
- 32 (2 x 16) (11)
- 32 (4 x 8) (1)
- 34 (2 x 17) (1)
- 36 (2 x 18) (1)
- 38 (2 x 19) (1)
- 40 (2 x 20) (9)
- 44 (2 x 22) (1)
- 48 (2 x 24) (1)
- 52 (2 x 26) (1)
- 52 (4 x 13) (1)
- 6 (2 x 3) (4)
- 68 (2 x 34) (1)
- 68 (4 x 17) (2)
- 8 (2 x 4) (8)
- 84 (2x42) (1)
- 84 (4 x 21) (1)
- Contact Material - Mating :
- Contact Finish Thickness - Post :
- Contact Material - Post :
- Applied Filters :
117 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
2,141
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,460
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 32 (2 x 16) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
2,020
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 30POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 30 (2 x 15) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
1,451
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 22POS TIN | 500 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | - | Tin | 22 (2 x 11) | Beryllium Copper | - | Beryllium Copper | |||
|
|
VIEW |
2,105
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 22POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 22 (2 x 11) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
1,451
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 28 (2 x 14) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
1,673
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS TIN | 500 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | - | Tin | 28 (2 x 14) | Beryllium Copper | - | Nickel | |||
|
|
VIEW |
3,135
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS TIN | 500 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | - | Tin | 32 (2 x 16) | Beryllium Copper | - | Nickel | |||
|
|
VIEW |
994
In-stock
|
3M | CONN IC DIP SOCKET ZIF 32POS GLD | OEM | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyether Imide (PEI), Glass Filled | 0.100" (2.54mm) | Gold | 250.0µin (6.35µm) | Gold | 32 (2 x 16) | Beryllium Copper | 250.0µin (6.35µm) | Beryllium Copper | |||
|
|
VIEW |
1,461
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 18POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 18 (2 x 9) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
VIEW |
2,339
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 22POS TIN | Diplomate DL | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 22 (1 x 22) | Beryllium Copper | - | Beryllium Copper | |||
|
|
VIEW |
2,337
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS TINLEAD | 500 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Tin-Lead | - | - | 20 (2 x 10) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
1,985
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 12POS TIN | Diplomate DL | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 12 (1 x 12) | Phosphor Bronze | - | Phosphor Bronze | |||
|
|
VIEW |
1,404
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS TIN | 500 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | - | Tin | 20 (2 x 10) | Beryllium Copper | - | Nickel | |||
|
|
VIEW |
3,879
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
634
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS TINLEAD | 500 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester | 0.100" (2.54mm) | Tin-Lead | - | Tin-Lead | 40 (2 x 20) | Beryllium Copper | - | Beryllium Copper | |||
|
|
VIEW |
3,271
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS TIN | 500 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | - | Tin | 40 (2 x 20) | Beryllium Copper | - | Beryllium Copper | |||
|
|
VIEW |
1,212
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 16POS TINLEAD | 500 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Tin-Lead | - | Tin-Lead | 16 (2 x 8) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
1,974
In-stock
|
On Shore Technology Inc. | CONN SOCKET PLCC 32POS TIN | ED | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | PLCC | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Tin | - | Tin | 32 (2 x 16) | Phosphor Bronze | - | Phosphor Bronze | |||
|
VIEW |
1,662
In-stock
|
On Shore Technology Inc. | CONN SOCKET PLCC 28POS TIN | ED | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | PLCC | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Tin | - | Tin | 28 (2 x 14) | Phosphor Bronze | - | Phosphor Bronze | |||
|
|
VIEW |
1,608
In-stock
|
CNC Tech | CONN SOCKET PLCC 20POS GOLD | - | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | PLCC | Polybutylene Terephthalate (PBT), Glass Filled | 0.050" (1.27mm) | Gold | - | Gold | 20 (4 x 5) | Phosphor Bronze | - | Phosphor Bronze | |||
|
VIEW |
3,365
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS TIN | Diplomate DL | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 20 (2 x 10) | Beryllium Copper | - | Beryllium Copper | |||
|
|
VIEW |
3,223
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS TIN | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,821
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 36POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 36 (2 x 18) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
3,477
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS TIN | 500 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | - | Tin | 24 (2 x 12) | Beryllium Copper | - | Beryllium Copper | |||
|
|
VIEW |
2,143
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS TINLEAD | 500 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester | 0.100" (2.54mm) | Tin-Lead | - | Tin-Lead | 24 (2 x 12) | Beryllium Copper | - | Brass, Copper | |||
|
|
VIEW |
1,821
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 34POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 34 (2 x 17) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
2,023
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,393
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | EJECT-A-DIP™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,459
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 29POS TIN | Diplomate DL | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 29 (1 x 29) | Phosphor Bronze | - | Phosphor Bronze | |||
