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Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Packaging	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Contact Material - Mating
GLOBAL STOCKS
	32-3554-11	RFQ VIEW	PDF RFQ	3,302 In-stock	Aries Electronics	CONN IC DIP SOCKET ZIF 32POS GLD		55	Active	Bulk	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	-	32 (2 x 16)	Beryllium Copper
	32-6552-11	RFQ VIEW	PDF RFQ	2,730 In-stock	Aries Electronics	CONN IC DIP SOCKET ZIF 32POS GLD		55	Active	Bulk	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	-	32 (2 x 16)	Beryllium Copper
	32-6551-11	RFQ VIEW	PDF RFQ	2,869 In-stock	Aries Electronics	CONN IC DIP SOCKET ZIF 32POS GLD		55	Active	Bulk	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	-	32 (2 x 16)	Beryllium Copper
	32-3553-11	RFQ VIEW	PDF RFQ	2,587 In-stock	Aries Electronics	CONN IC DIP SOCKET ZIF 32POS GLD		55	Active	Bulk	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	-	32 (2 x 16)	Beryllium Copper
	32-3552-11	RFQ VIEW	PDF RFQ	2,752 In-stock	Aries Electronics	CONN IC DIP SOCKET ZIF 32POS GLD		55	Active	Bulk	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	-	32 (2 x 16)	Beryllium Copper
	32-3551-11	RFQ VIEW	PDF RFQ	2,932 In-stock	Aries Electronics	CONN IC DIP SOCKET ZIF 32POS GLD		55	Active	Bulk	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	-	32 (2 x 16)	Beryllium Copper
	32-6553-10	RFQ VIEW	PDF RFQ	2,159 In-stock	Aries Electronics	CONN IC DIP SOCKET ZIF 32POS GLD		55	Active	Bulk	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	-	32 (2 x 16)	Beryllium Copper
	32-6554-11	RFQ VIEW	PDF RFQ	3,856 In-stock	Aries Electronics	CONN IC DIP SOCKET ZIF 32POS GLD		55	Active	Bulk	Through Hole	Solder	Closed Frame	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	Polyphenylene Sulfide (PPS), Glass Filled	0.100" (2.54mm)	Gold	-	32 (2 x 16)	Beryllium Copper

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