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32 results
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
GLOBAL STOCKS
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32-6553-16
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RFQ
1,918
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Nickel
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32-6552-16
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RFQ
937
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Copper
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32-6551-16
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VIEW
RFQ
713
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Copper
Default Photo
32-3553-16
RFQ
VIEW
RFQ
1,286
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Copper
Default Photo
32-3552-16
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VIEW
RFQ
901
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Copper
Default Photo
32-3551-16
RFQ
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RFQ
2,996
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Copper
Default Photo
32-6552-18
RFQ
VIEW
RFQ
2,381
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Nickel
Default Photo
32-6551-18
RFQ
VIEW
RFQ
1,898
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Nickel
Default Photo
32-3553-18
RFQ
VIEW
RFQ
1,246
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Nickel
Default Photo
32-3552-18
RFQ
VIEW
RFQ
1,442
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Nickel
Default Photo
32-3551-18
RFQ
VIEW
RFQ
2,683
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Nickel
Default Photo
28-6553-18
RFQ
VIEW
RFQ
3,707
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper
Default Photo
32-6554-16
RFQ
VIEW
RFQ
1,788
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Copper
Default Photo
32-6554-18
RFQ
VIEW
RFQ
2,448
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Nickel
Default Photo
32-3554-18
RFQ
VIEW
RFQ
3,713
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk -55°C ~ 250°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyetheretherketone (PEEK), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Nickel
Default Photo
32-3554-11
RFQ
VIEW
RFQ
3,302
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 32 (2 x 16) Beryllium Copper
Default Photo
32-3554-16
RFQ
VIEW
RFQ
1,784
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Copper
Default Photo
32-3554-10
RFQ
VIEW
RFQ
2,034
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper
Default Photo
32-6552-11
RFQ
VIEW
RFQ
2,730
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 32 (2 x 16) Beryllium Copper
Default Photo
32-6551-11
RFQ
VIEW
RFQ
2,869
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 32 (2 x 16) Beryllium Copper
Default Photo
32-3553-11
RFQ
VIEW
RFQ
2,587
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 32 (2 x 16) Beryllium Copper
Default Photo
32-3552-11
RFQ
VIEW
RFQ
2,752
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 32 (2 x 16) Beryllium Copper
Default Photo
32-3551-11
RFQ
VIEW
RFQ
2,932
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 32 (2 x 16) Beryllium Copper
Default Photo
32-6553-11
RFQ
VIEW
RFQ
2,789
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Copper
Default Photo
32-6553-10
RFQ
VIEW
RFQ
2,159
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 32 (2 x 16) Beryllium Copper
Default Photo
32-6552-10
RFQ
VIEW
RFQ
813
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper
Default Photo
32-6551-10
RFQ
VIEW
RFQ
2,766
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper
Default Photo
32-3553-10
RFQ
VIEW
RFQ
1,373
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper
Default Photo
32-3552-10
RFQ
VIEW
RFQ
1,631
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper
Default Photo
32-3551-10
RFQ
VIEW
RFQ
2,117
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 32POS TIN 55 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper
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