Contact Finish Thickness - Mating :
Number of Positions or Pins (Grid) :
Contact Material - Mating :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
GLOBAL STOCKS
2-641267-4
RFQ
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RFQ
3,700
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD Diplomate DL Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 15.0µin (0.38µm) 28 (2 x 14) Phosphor Bronze
1-1825108-2
RFQ
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RFQ
2,497
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD Diplomate DL Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper
1825375-2
RFQ
VIEW
RFQ
3,227
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD Diplomate DL Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 15.0µin (0.38µm) 28 (2 x 14) Phosphor Bronze
1-1825376-2
RFQ
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RFQ
3,125
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD Diplomate DL Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper
1825375-3
RFQ
VIEW
RFQ
2,655
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD Diplomate DL Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 15.0µin (0.38µm) 40 (2 x 20) Phosphor Bronze
Default Photo
RFQ
VIEW
RFQ
1,386
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD Diplomate DL Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper