Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
GLOBAL STOCKS
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1,588
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TE Connectivity AMP Connectors CONN SOCKET SIP 20POS GOLD Diplomate DL Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 20 (1 x 20) Beryllium Copper
1-1825108-2
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2,497
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD Diplomate DL Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper
2-641262-4
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RFQ
3,214
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS GOLD Diplomate DL Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Phosphor Bronze
1-1825376-2
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RFQ
3,125
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD Diplomate DL Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper
2-640358-2
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RFQ
751
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS GOLD Diplomate DL Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper
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1,386
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD Diplomate DL Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper