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22 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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GLOBAL STOCKS | ||||||||||||||||||||||||
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VIEW |
1,331
In-stock
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Aries Electronics | CONN SOCKET SIP 30POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 30 (1 x 30) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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VIEW |
3,297
In-stock
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Aries Electronics | CONN SOCKET SIP 30POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 30 (1 x 30) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
892
In-stock
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Aries Electronics | CONN SOCKET SIP 30POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 30 (1 x 30) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
1,672
In-stock
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Aries Electronics | CONN SOCKET SIP 30POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 30 (1 x 30) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
3,587
In-stock
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Aries Electronics | CONN SOCKET SIP 30POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 30 (1 x 30) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
3,766
In-stock
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Aries Electronics | CONN SOCKET SIP 30POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 30 (1 x 30) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
1,268
In-stock
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Aries Electronics | CONN SOCKET SIP 30POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 30 (1 x 30) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
2,776
In-stock
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Aries Electronics | CONN SOCKET SIP 30POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 30 (1 x 30) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
2,099
In-stock
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Aries Electronics | CONN SOCKET SIP 30POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 30 (1 x 30) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
1,634
In-stock
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Aries Electronics | CONN SOCKET SIP 30POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 30 (1 x 30) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
1,105
In-stock
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Aries Electronics | CONN SOCKET SIP 30POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 30 (1 x 30) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
1,930
In-stock
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Aries Electronics | CONN SOCKET SIP 30POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 30 (1 x 30) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
2,597
In-stock
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Aries Electronics | CONN SOCKET SIP 30POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 30 (1 x 30) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
1,777
In-stock
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Aries Electronics | CONN SOCKET SIP 30POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 30 (1 x 30) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
3,356
In-stock
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Aries Electronics | CONN SOCKET SIP 30POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 30 (1 x 30) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,687
In-stock
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Aries Electronics | CONN SOCKET SIP 30POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 50.0µin (1.27µm) | Tin | 30 (1 x 30) | Phosphor Bronze | 50.0µin (1.27µm) | Phosphor Bronze | |||
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VIEW |
982
In-stock
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Aries Electronics | CONN SOCKET SIP 30POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 30 (1 x 30) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
3,119
In-stock
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Mill-Max Manufacturing Corp. | CONN SOCKET SIP 30POS GOLD | 714 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 30 (1 x 30) | Beryllium Copper | 30.0µin (0.76µm) | Brass Alloy | |||
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VIEW |
3,323
In-stock
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Aries Electronics | CONN SOCKET SIP 30POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 30 (1 x 30) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,185
In-stock
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Aries Electronics | CONN SOCKET SIP 30POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 30 (1 x 30) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,042
In-stock
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Aries Electronics | CONN SOCKET SIP 30POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 30 (1 x 30) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
2,588
In-stock
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Harwin Inc. | CONN SOCKET SIP 30POS GOLD | D01-997 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | - | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 30 (1 x 30) | Beryllium Copper | 196.9µin (5.00µm) | Brass |