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32 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||
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VIEW |
2,014
In-stock
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Aries Electronics | CONN IC DIP SOCKET 16POS TIN | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 16 (2 x 8) | Phosphor Bronze | |||
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VIEW |
3,190
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS TIN | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 14 (2 x 7) | Phosphor Bronze | |||
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VIEW |
2,955
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS TIN | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 14 (2 x 7) | Phosphor Bronze | |||
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VIEW |
1,894
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS TIN | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 14 (2 x 7) | Phosphor Bronze | |||
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VIEW |
1,497
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS TIN | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 14 (2 x 7) | Phosphor Bronze | |||
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VIEW |
1,329
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS TIN | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 14 (2 x 7) | Phosphor Bronze | |||
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VIEW |
3,103
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS TIN | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 14 (2 x 7) | Phosphor Bronze | |||
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VIEW |
1,969
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS TIN | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 14 (2 x 7) | Phosphor Bronze | |||
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VIEW |
3,776
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS TIN | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 14 (2 x 7) | Phosphor Bronze | |||
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VIEW |
2,658
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS TIN | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 14 (2 x 7) | Phosphor Bronze | |||
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|
VIEW |
1,553
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS TIN | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 14 (2 x 7) | Phosphor Bronze | |||
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VIEW |
918
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS TIN | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 14 (2 x 7) | Phosphor Bronze | |||
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VIEW |
3,120
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS TIN | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 14 (2 x 7) | Phosphor Bronze | |||
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VIEW |
1,752
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS TIN | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 14 (2 x 7) | Phosphor Bronze | |||
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VIEW |
3,645
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS TIN | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 14 (2 x 7) | Phosphor Bronze | |||
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VIEW |
3,113
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS TIN | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 14 (2 x 7) | Phosphor Bronze | |||
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VIEW |
2,847
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS TIN | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 14 (2 x 7) | Phosphor Bronze | |||
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VIEW |
1,825
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS TIN | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 14 (2 x 7) | Phosphor Bronze | |||
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VIEW |
3,518
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS TIN | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 14 (2 x 7) | Phosphor Bronze | |||
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VIEW |
1,731
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS TIN | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 14 (2 x 7) | Phosphor Bronze | |||
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VIEW |
2,611
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS TIN | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 14 (2 x 7) | Phosphor Bronze | |||
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VIEW |
1,845
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS TIN | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 14 (2 x 7) | Phosphor Bronze | |||
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VIEW |
2,666
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS TIN | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 14 (2 x 7) | Phosphor Bronze | |||
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VIEW |
1,456
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS TIN | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 14 (2 x 7) | Phosphor Bronze | |||
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VIEW |
3,385
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS TIN | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 14 (2 x 7) | Phosphor Bronze | |||
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VIEW |
1,596
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS TIN | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 14 (2 x 7) | Phosphor Bronze | |||
|
VIEW |
3,697
In-stock
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Aries Electronics | CONN IC DIP SOCKET 14POS TIN | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 14 (2 x 7) | Phosphor Bronze | |||
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VIEW |
1,776
In-stock
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Aries Electronics | CONN IC DIP SOCKET 16POS TIN | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 16 (2 x 8) | Phosphor Bronze | |||
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VIEW |
1,056
In-stock
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Aries Electronics | CONN IC DIP SOCKET 16POS TIN | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 16 (2 x 8) | Phosphor Bronze | |||
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VIEW |
2,566
In-stock
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Aries Electronics | CONN IC DIP SOCKET 16POS TIN | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 16 (2 x 8) | Phosphor Bronze | |||
