- Manufacture :
- Series :
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- Pitch - Mating :
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8 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||
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VIEW |
2,113
In-stock
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3M | CONN ZIG-ZAG ZIF 34POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 34 (2 x 17) | Beryllium Copper | Beryllium Copper | |||
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|
VIEW |
3,597
In-stock
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3M | CONN ZIG-ZAG ZIF 34POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 34 (2 x 17) | Beryllium Copper | Beryllium Copper | |||
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|
VIEW |
941
In-stock
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3M | CONN ZIG-ZAG ZIF 34POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 34 (2 x 17) | Beryllium Copper | Beryllium Copper | |||
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VIEW |
3,476
In-stock
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Aries Electronics | CONN IC DIP SOCKET 34POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 34 (2 x 17) | Beryllium Copper | Phosphor Bronze | |||
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VIEW |
2,509
In-stock
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Aries Electronics | CONN IC DIP SOCKET 34POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 34 (2 x 17) | Beryllium Copper | Phosphor Bronze | |||
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|
VIEW |
1,078
In-stock
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Aries Electronics | CONN IC DIP SOCKET 34POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 34 (2 x 17) | Beryllium Copper | Brass | |||
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VIEW |
3,084
In-stock
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Aries Electronics | CONN IC DIP SOCKET 34POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 34 (2 x 17) | Beryllium Copper | Brass | |||
|
VIEW |
2,833
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 34POS GOLD | 714 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Closed Frame | DIP, 0.1" (2.54mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 34 (2 x 17) | Beryllium Copper | Brass Alloy | |||
