Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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1,060
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 6POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 6 (2 x 3) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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3,518
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 6POS GOLD 122 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 6 (2 x 3) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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1,367
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 6POS GOLD 124 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 6 (2 x 3) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,521
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Aries Electronics CONN IC DIP SOCKET 6POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 6 (2 x 3) Beryllium Copper 10.0µin (0.25µm) Brass
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1,410
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Aries Electronics CONN IC DIP SOCKET 6POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 6 (2 x 3) Beryllium Copper 10.0µin (0.25µm) Brass
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3,424
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 6POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 6 (2 x 3) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,781
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Aries Electronics CONN IC DIP SOCKET 6POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 6 (2 x 3) Beryllium Copper 10.0µin (0.25µm) Brass
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778
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Aries Electronics CONN IC DIP SOCKET 6POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 6 (2 x 3) Beryllium Copper 10.0µin (0.25µm) Brass
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2,263
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 6POS GOLD 121 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 6 (2 x 3) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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2,430
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 6POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 6 (2 x 3) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
121-83-306-41-001101
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3,966
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Preci-Dip CONN IC DIP SOCKET 6POS GOLD 121 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 6 (2 x 3) Beryllium Copper - Brass
123-83-306-41-001101
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1,126
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Preci-Dip CONN IC DIP SOCKET 6POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 6 (2 x 3) Beryllium Copper - Brass
122-83-306-41-001101
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3,969
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Preci-Dip CONN IC DIP SOCKET 6POS GOLD 122 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 6 (2 x 3) Beryllium Copper - Brass
123-87-306-41-001101
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2,125
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Preci-Dip CONN IC DIP SOCKET 6POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 6 (2 x 3) Beryllium Copper - Brass
122-87-306-41-001101
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1,662
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Preci-Dip CONN IC DIP SOCKET 6POS GOLD 122 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 6 (2 x 3) Beryllium Copper - Brass
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3,571
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Aries Electronics CONN IC DIP SOCKET 6POS GOLD 503 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 6 (2 x 3) Beryllium Copper 10.0µin (0.25µm) Phosphor Bronze
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2,574
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Aries Electronics CONN IC DIP SOCKET 6POS GOLD 503 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 6 (2 x 3) Beryllium Copper 10.0µin (0.25µm) Phosphor Bronze
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3,240
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Aries Electronics CONN IC DIP SOCKET 6POS GOLD 503 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.2" (5.08mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 6 (2 x 3) Beryllium Copper 10.0µin (0.25µm) Phosphor Bronze
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1,369
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Aries Electronics CONN IC DIP SOCKET 6POS GOLD 503 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 6 (2 x 3) Beryllium Copper 10.0µin (0.25µm) Phosphor Bronze
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2,371
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Aries Electronics CONN IC DIP SOCKET 6POS GOLD 503 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 6 (2 x 3) Beryllium Copper 10.0µin (0.25µm) Phosphor Bronze
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1,653
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 6POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 6 (2 x 3) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,198
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 6POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 6 (2 x 3) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,431
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Preci-Dip CONN IC DIP SOCKET 6POS GOLD 124 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 6 (2 x 3) Beryllium Copper - Brass
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3,164
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Harwin Inc. CONN IC DIP SOCKET 6POS GOLD D0 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 6 (2 x 3) Beryllium Copper 196.9µin (5.00µm) Brass