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Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Material - Post
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	20-6503-31	RFQ VIEW	PDF RFQ	2,958 In-stock	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD		503	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	20 (2 x 10)	Beryllium Copper	Phosphor Bronze
	20-6503-21	RFQ VIEW	PDF RFQ	2,293 In-stock	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD		503	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	20 (2 x 10)	Beryllium Copper	Phosphor Bronze
	20-4508-31	RFQ VIEW	PDF RFQ	3,276 In-stock	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD		508	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Open Frame	DIP, 0.4" (10.16mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	20 (2 x 10)	Beryllium Copper	Brass
	20-4508-21	RFQ VIEW	PDF RFQ	2,268 In-stock	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD		508	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Open Frame	DIP, 0.4" (10.16mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	20 (2 x 10)	Beryllium Copper	Brass
	20-3508-31	RFQ VIEW	PDF RFQ	3,305 In-stock	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD		508	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	20 (2 x 10)	Beryllium Copper	Brass
	20-3508-21	RFQ VIEW	PDF RFQ	2,230 In-stock	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD		508	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	20 (2 x 10)	Beryllium Copper	Brass
	20-3508-312	RFQ VIEW	PDF RFQ	1,288 In-stock	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD		508	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	20 (2 x 10)	Beryllium Copper	Brass
	20-3508-212	RFQ VIEW	PDF RFQ	2,321 In-stock	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD		508	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	20 (2 x 10)	Beryllium Copper	Brass
	20-9503-31	RFQ VIEW	PDF RFQ	3,807 In-stock	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD		503	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.9" (22.86mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	20 (2 x 10)	Beryllium Copper	Phosphor Bronze
	20-9503-21	RFQ VIEW	PDF RFQ	1,801 In-stock	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD		503	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.9" (22.86mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	20 (2 x 10)	Beryllium Copper	Phosphor Bronze
	20-3508-311	RFQ VIEW	PDF RFQ	3,775 In-stock	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD		508	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	20 (2 x 10)	Beryllium Copper	Brass
	20-3508-211	RFQ VIEW	PDF RFQ	1,581 In-stock	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD		508	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	20 (2 x 10)	Beryllium Copper	Brass
	20-3503-31	RFQ VIEW	PDF RFQ	2,649 In-stock	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD		503	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	20 (2 x 10)	Beryllium Copper	Phosphor Bronze
	20-3503-21	RFQ VIEW	PDF RFQ	1,795 In-stock	Aries Electronics	CONN IC DIP SOCKET 20POS GOLD		503	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	20 (2 x 10)	Beryllium Copper	Phosphor Bronze

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