Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
Default Photo
RFQ
VIEW
RFQ
1,975
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 124 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
2,593
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-99-310-41-001000
RFQ
VIEW
RFQ
2,760
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS TINLEAD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
1,692
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
915
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10 (2 x 5) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
3,190
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 122 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10 (2 x 5) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
2,932
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
1,681
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 121 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10 (2 x 5) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
3,933
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-13-310-41-001000
RFQ
VIEW
RFQ
1,171
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10 (2 x 5) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
2,560
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
1,695
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
3,184
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-91-310-41-001000
RFQ
VIEW
RFQ
1,719
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
3,745
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 614 Active Tube -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
2,434
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
1,049
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 10POS GOLD - Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) - 10 (2 x 5) Beryllium Copper - Brass
116-83-310-41-004101
RFQ
VIEW
RFQ
3,171
In-stock
Preci-Dip CONN IC DIP SOCKET 10POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 10 (2 x 5) Beryllium Copper - Brass
Default Photo
RFQ
VIEW
RFQ
1,883
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-310-41-001000
RFQ
VIEW
RFQ
3,792
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (2 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-83-310-41-001101
RFQ
VIEW
RFQ
3,468
In-stock
Preci-Dip CONN IC DIP SOCKET 10POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 10 (2 x 5) Beryllium Copper - Brass
116-87-310-41-003101
RFQ
VIEW
RFQ
3,405
In-stock
Preci-Dip CONN IC DIP SOCKET 10POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 10 (2 x 5) Beryllium Copper - Brass
115-83-310-41-003101
RFQ
VIEW
RFQ
2,934
In-stock
Preci-Dip CONN IC DIP SOCKET 10POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 10 (2 x 5) Beryllium Copper - Brass
Default Photo
RFQ
VIEW
RFQ
699
In-stock
Preci-Dip CONN IC DIP SOCKET 10POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 10 (2 x 5) Beryllium Copper - Brass
116-87-310-41-018101
RFQ
VIEW
RFQ
2,613
In-stock
Preci-Dip CONN IC DIP SOCKET 10POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 10 (2 x 5) Beryllium Copper - Brass
115-83-310-41-001101
RFQ
VIEW
RFQ
794
In-stock
Preci-Dip CONN IC DIP SOCKET 10POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 10 (2 x 5) Beryllium Copper - Brass
116-87-310-41-006101
RFQ
VIEW
RFQ
3,632
In-stock
Preci-Dip CONN IC DIP SOCKET 10POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 10 (2 x 5) Beryllium Copper - Brass
612-87-310-41-001101
RFQ
VIEW
RFQ
1,845
In-stock
Preci-Dip CONN IC DIP SOCKET 10POS GOLD 612 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 10 (2 x 5) Beryllium Copper - Brass
Default Photo
RFQ
VIEW
RFQ
2,807
In-stock
Preci-Dip CONN IC DIP SOCKET 10POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 10 (2 x 5) Beryllium Copper - Brass
115-87-310-41-003101
RFQ
VIEW
RFQ
3,578
In-stock
Preci-Dip CONN IC DIP SOCKET 10POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 10 (2 x 5) Beryllium Copper - Brass