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Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Material - Post
GLOBAL STOCKS
	16-3508-311	RFQ VIEW	PDF RFQ	3,609 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD		508	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	16 (2 x 8)	Beryllium Copper	Brass
	16-3508-211	RFQ VIEW	PDF RFQ	2,231 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD		508	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	16 (2 x 8)	Beryllium Copper	Brass
	16-C280-31	RFQ VIEW	PDF RFQ	2,009 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD		EJECT-A-DIP™	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	16 (2 x 8)	Beryllium Copper	Brass
	16-C280-21	RFQ VIEW	PDF RFQ	3,704 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD		EJECT-A-DIP™	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	16 (2 x 8)	Beryllium Copper	Brass
	16-C195-31	RFQ VIEW	PDF RFQ	3,219 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD		EJECT-A-DIP™	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	16 (2 x 8)	Beryllium Copper	Brass
	16-C195-21	RFQ VIEW	PDF RFQ	1,252 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD		EJECT-A-DIP™	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	16 (2 x 8)	Beryllium Copper	Brass
	16-3508-312	RFQ VIEW	PDF RFQ	1,703 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD		508	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	16 (2 x 8)	Beryllium Copper	Brass
	16-3508-212	RFQ VIEW	PDF RFQ	1,306 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD		508	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	16 (2 x 8)	Beryllium Copper	Brass
	16-6503-31	RFQ VIEW	PDF RFQ	2,037 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD		503	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	16 (2 x 8)	Beryllium Copper	Phosphor Bronze
	16-6503-21	RFQ VIEW	PDF RFQ	1,773 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD		503	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	16 (2 x 8)	Beryllium Copper	Phosphor Bronze
	16-3503-31	RFQ VIEW	PDF RFQ	2,940 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD		503	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	16 (2 x 8)	Beryllium Copper	Phosphor Bronze
	16-3503-21	RFQ VIEW	PDF RFQ	2,349 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD		503	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	16 (2 x 8)	Beryllium Copper	Phosphor Bronze
	16-C280-11H	RFQ VIEW	PDF RFQ	1,334 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD		EJECT-A-DIP™	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	16 (2 x 8)	Beryllium Copper	Brass
	16-C195-11	RFQ VIEW	PDF RFQ	1,713 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD		EJECT-A-DIP™	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	16 (2 x 8)	Beryllium Copper	Brass
	16-3508-31	RFQ VIEW	PDF RFQ	2,381 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD		508	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	16 (2 x 8)	Beryllium Copper	Brass
	16-3508-21	RFQ VIEW	PDF RFQ	1,610 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD		508	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	16 (2 x 8)	Beryllium Copper	Brass
	16-C280-11	RFQ VIEW	PDF RFQ	859 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD		EJECT-A-DIP™	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	16 (2 x 8)	Beryllium Copper	Brass

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