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Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Contact Material - Mating
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	2-1825410-0	RFQ VIEW	PDF RFQ	1,588 In-stock	TE Connectivity AMP Connectors	CONN SOCKET SIP 20POS GOLD		Diplomate DL	Active	Tube	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	SIP	Thermoplastic, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	20 (1 x 20)	Beryllium Copper
	1-1825109-3	RFQ VIEW	PDF RFQ	3,551 In-stock	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 40POS GOLD		Diplomate DL	Active	Tube	-55°C ~ 125°C	Through Hole	Solder	Open Frame	DIP, 0.6" (15.24mm) Row Spacing	Thermoplastic, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	40 (2 x 20)	Beryllium Copper
	2-641615-2	RFQ VIEW	PDF RFQ	1,430 In-stock	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 28POS GOLD		Diplomate DL	Active	Tube	-55°C ~ 125°C	Through Hole	Solder	Open Frame	DIP, 0.6" (15.24mm) Row Spacing	Thermoplastic, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	28 (2 x 14)	Beryllium Copper
	1-1825093-6	RFQ VIEW	PDF RFQ	2,005 In-stock	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 20POS GOLD		Diplomate DL	Active	Tube	-55°C ~ 125°C	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Thermoplastic, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	20 (2 x 10)	Beryllium Copper
	1-1825376-3	RFQ VIEW	PDF RFQ	1,282 In-stock	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 40POS GOLD		Diplomate DL	Active	Tube	-55°C ~ 125°C	Through Hole	Solder	Open Frame	DIP, 0.6" (15.24mm) Row Spacing	Thermoplastic, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	40 (2 x 20)	Beryllium Copper
	1-1825108-2	RFQ VIEW	PDF RFQ	2,497 In-stock	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 28POS GOLD		Diplomate DL	Active	Tube	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Thermoplastic, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	28 (2 x 14)	Beryllium Copper
	1-1825376-2	RFQ VIEW	PDF RFQ	3,125 In-stock	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 28POS GOLD		Diplomate DL	Active	Tube	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Thermoplastic, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	28 (2 x 14)	Beryllium Copper
	1-1825109-2	RFQ VIEW	PDF RFQ	3,610 In-stock	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 28POS GOLD		Diplomate DL	Active	Tube	-55°C ~ 125°C	Through Hole	Solder	Open Frame	DIP, 0.6" (15.24mm) Row Spacing	Thermoplastic, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	28 (2 x 14)	Beryllium Copper
	1-1825093-4	RFQ VIEW	PDF RFQ	3,101 In-stock	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 16POS GOLD		Diplomate DL	Active	Tube	-55°C ~ 125°C	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Thermoplastic, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	16 (2 x 8)	Beryllium Copper
	3-1825276-2	RFQ VIEW	PDF RFQ	2,110 In-stock	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 32POS GOLD		Diplomate DL	Active	Tube	-55°C ~ 125°C	Through Hole	Solder	Open Frame	DIP, 0.6" (15.24mm) Row Spacing	Thermoplastic, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	32 (2 x 16)	Beryllium Copper
	1-1825276-2	RFQ VIEW	PDF RFQ	3,427 In-stock	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 32POS GOLD		Diplomate DL	Active	Tube	-55°C ~ 125°C	Through Hole	Solder	Open Frame	DIP, 0.6" (15.24mm) Row Spacing	Thermoplastic, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	32 (2 x 16)	Beryllium Copper
	2-640379-2	RFQ VIEW	PDF RFQ	1,386 In-stock	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 40POS GOLD		Diplomate DL	Active	Tube	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Thermoplastic, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	40 (2 x 20)	Beryllium Copper

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