Contact Finish - Post :
Contact Finish Thickness - Post :
Contact Material - Post :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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2,104
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Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 125°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold - Beryllium Copper 10.0µin (0.25µm) Brass
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1,443
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Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 125°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold - Beryllium Copper 10.0µin (0.25µm) Brass
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750
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 64POS GOLD 324 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 64 (1 x 64) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,937
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Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 125°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold - Beryllium Copper 10.0µin (0.25µm) Brass
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1,831
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Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 125°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold - Beryllium Copper 10.0µin (0.25µm) Brass
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1,852
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 64POS GOLD 321 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 64 (1 x 64) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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3,335
In-stock
Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 125°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold - Beryllium Copper 10.0µin (0.25µm) Brass
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3,991
In-stock
Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 125°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold - Beryllium Copper 10.0µin (0.25µm) Brass
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1,124
In-stock
Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 125°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold - Beryllium Copper 10.0µin (0.25µm) Brass
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3,299
In-stock
Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 125°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold - Beryllium Copper 10.0µin (0.25µm) Brass
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1,928
In-stock
Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 125°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold - Beryllium Copper 10.0µin (0.25µm) Brass
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1,791
In-stock
Aries Electronics CONN SOCKET SIP 38POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 38 (1 x 38) Beryllium Copper 200.0µin (5.08µm) Brass
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1,305
In-stock
Aries Electronics CONN SOCKET SIP 38POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 38 (1 x 38) Beryllium Copper 200.0µin (5.08µm) Brass
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3,982
In-stock
Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 125°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold - Beryllium Copper 10.0µin (0.25µm) Brass
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3,788
In-stock
Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 125°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold - Beryllium Copper 10.0µin (0.25µm) Brass
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2,742
In-stock
Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 125°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold - Beryllium Copper 10.0µin (0.25µm) Brass
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1,151
In-stock
Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 125°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold - Beryllium Copper 10.0µin (0.25µm) Brass
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3,329
In-stock
Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 125°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold - Beryllium Copper 10.0µin (0.25µm) Brass
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1,179
In-stock
Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 125°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold - Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
1,585
In-stock
Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 125°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold - Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
650
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 32POS GOLD 324 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 32 (1 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,099
In-stock
Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 125°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold - Beryllium Copper 10.0µin (0.25µm) Brass
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1,092
In-stock
Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 125°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold - Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
1,973
In-stock
Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 125°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold - Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
3,205
In-stock
Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 125°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold - Beryllium Copper 10.0µin (0.25µm) Brass
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1,211
In-stock
Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 125°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold - Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
2,348
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 64POS GOLD 326 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 64 (1 x 64) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,410
In-stock
Aries Electronics CONN SOCKET SIP 40POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (1 x 40) Beryllium Copper 200.0µin (5.08µm) Brass
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2,813
In-stock
Aries Electronics CONN SOCKET SIP 40POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (1 x 40) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
1,881
In-stock
Aries Electronics CONN SOCKET PGA GOLD PGM Active Bulk -55°C ~ 125°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold - Beryllium Copper 10.0µin (0.25µm) Brass